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CY62167EV30 MoBL

®

Document #: 38-05446 Rev. *E

Page 13 of 14

Document History Page

Document Title: CY62167EV30 MoBL

®

 16-Mbit (1M x 16 / 2M x 8) Static RAM

Document Number: 38-05446

REV.

ECN NO.

Orig. of 

Change

Submission 

Date

Description of Change

**

202600

AJU

01/23/2004

New Data Sheet

*A

463674

NXR

See ECN

Converted from Advance Information to Preliminary

Removed ‘L’ bin and 35 ns speed bin from product offering

Modified Data sheet to include x8 configurability.

Changed ball E3 in FBGA pinout from DNU to NC

Changed the I

SB2(Typ)

 value from 1.3 

μ

A

 

to

 

1.5 

μ

A

Changed the I

CC(Max) 

value from 40 mA to 25 mA

Changed Vcc stabilization time in footnote #9 from 100 

µ

s to 200 

µ

s

Changed the AC Test Load Capacitance value from 50 pF to 30 pF

Corrected typo in Data Retention Characteristics (t

R

) from 100 

µ

s to t

RC 

ns

Changed t

OHA

, t

LZCE

, t

LZBE

, and t

LZWE

 from 6 ns to 10 ns

Changed t

LZOE

 from 3 ns to 5 ns.

Changed t

HZOE

, t

HZCE

, t

HZBE

, and t

HZWE

 from 15 ns to 18 ns

Changed t

SCE

, t

AW

, and t

BW 

from 40 ns to 35 ns

Changed t

PE 

from 30 ns to 35 ns

Changed t

SD 

from 20 ns to 25 ns

Updated 48 ball FBGA Package Information.

Updated the Ordering Information table 

*B

469169

NSI

See ECN

Minor Change: Moved to external web

*C

1130323

VKN

See ECN

Converted from preliminary to final

Changed I

CC

 max spec from 2.8 mA to 4.0 mA for f=1MHz

Changed I

CC

 typ spec from 22 mA to 25 mA for f=f

max

Changed I

CC

 max spec from 25 mA to 30 mA for f=f

max

Added V

IL

 spec for TSOP I package and footnote# 9

Added footnote# 10 related to I

SB2

 and I

CCDR

Changed I

SB1

 and I

SB2

 spec from 8.5 

μ

A to 12 

μ

A

Changed I

CCDR

 spec from 8 

μ

A to 10 

μ

A

Added footnote# 15 related to AC timing parameters

*D

1323984

VKN/AESA

See ECN

Modified I

CCDR

 spec for TSOP I package

Added 48-Ball VFBGA (6 x 7 x 1mm) package

Added footnote# 1 related to VFBGA (6 x 7 x 1mm) package

Updated Ordering Information table 

*E

2678799

VKN/PYRS

03/25/2009

Added Automotive-A information

[+] Feedback 

Содержание CY62167EV30

Страница 1: ...HIGH The input and output pins I O0 through I O15 are placed in a high impedance state when the device is deselected CE1 HIGH or CE2 LOW outputs are disabled OE HIGH both Byte High Enable and Byte Lo...

Страница 2: ...21 22 23 24 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 A15 A14 A13 A12 A11 A10 A9 A8 A19 NC WE CE2 NC BHE BLE A18 A17 A7 A6 A5 A4 A3 A2 A1 A16 BYTE Vss IO15 A20 IO7 IO14...

Страница 3: ...package 0 3 0 7 9 V IIX Input Leakage Current GND VI VCC 1 1 A IOZ Output Leakage Current GND VO VCC Output Disabled 1 1 A ICC VCC Operating Supply Current f fMAX 1 tRC VCC VCC max IOUT 0 mA CMOS leve...

Страница 4: ...V ICCDR 10 Data Retention Current VCC 1 5V to 3 0V CE1 VCC 0 2V CE2 0 2V VIN VCC 0 2V or VIN 0 2V Industrial Auto A 45ZXI TSOP I 8 A VCC 1 5V CE1 VCC 0 2V CE2 0 2V VIN VCC 0 2V or VIN 0 2V Industrial...

Страница 5: ...tSD Data Setup to Write End 25 ns tHD Data Hold from Write End 0 ns tHZWE WE LOW to High Z 16 17 18 ns tLZWE WE HIGH to Low Z 16 10 ns Notes 14 Test conditions for all parameters other than tri state...

Страница 6: ...PREVIOUS DATA VALID DATA VALID RC tAA tOHA tRC ADDRESS DATA OUT 50 50 DATA VALID tRC tACE tDOE tLZOE tLZCE tPU HIGH IMPEDANCE tHZOE tPD tHZBE tLZBE tHZCE tDBE OE CE1 ADDRESS CE2 BHE BLE DATA OUT VCC S...

Страница 7: ...rms continued tHD tSD tPWE tSA tHA tAW tSCE tWC tHZOE VALID DATA tBW NOTE 24 CE1 ADDRESS CE2 WE DATA I O OE BHE BLE Notes 22 Data IO is high impedance if OE VIH 23 If CE1 goes HIGH and CE2 goes LOW si...

Страница 8: ...le No 2 Figure 9 shows WE controlled OE LOW write cycle waveforms 23 Figure 9 Write Cycle No 3 Switching Waveforms continued tHD tSD tPWE tHA tAW tSCE tWC tHZOE VALID DATA tBW tSA NOTE 24 CE1 ADDRESS...

Страница 9: ...Read Active ICC L H H L H L Data Out I O0 I O7 High Z I O8 I O15 Read Active ICC L H H L L H High Z I O0 I O7 Data Out I O8 I O15 Read Active ICC L H H H L H High Z Output Disabled Active ICC L H H H...

Страница 10: ...62167EV30LL 45BVXI 51 85150 48 ball VFBGA 6 x 8 x 1 mm Pb free CY62167EV30LL 45ZXI 51 85183 48 pin TSOP I Pb free CY62167EV30LL 45ZXA 51 85183 48 pin TSOP I Pb free Automotive A Shaded areas contain p...

Страница 11: ...continued A 1 A1 CORNER 0 75 0 75 0 30 0 05 48X 0 25 M C A B 0 05 M C B A 0 15 4X 0 21 0 05 1 00 MAX C SEATING PLANE 0 55 MAX 0 25 C 0 10 C A1 CORNER TOP VIEW BOTTOM VIEW 2 3 4 3 75 5 25 B C D E F G H...

Страница 12: ...ge Diagrams continued 1 N 0 020 0 50 0 007 0 17 0 037 0 95 0 002 0 05 0 5 MAX 0 028 0 70 0 010 0 25 0 004 0 10 0 011 0 27 0 041 1 05 0 047 1 20 0 472 12 00 0 724 18 40 0 787 20 00 0 006 0 15 TYP 0 020...

Страница 13: ...Changed tLZOE from 3 ns to 5 ns Changed tHZOE tHZCE tHZBE and tHZWE from 15 ns to 18 ns Changed tSCE tAW and tBW from 40 ns to 35 ns Changed tPE from 30 ns to 35 ns Changed tSD from 20 ns to 25 ns Up...

Страница 14: ...firmware in support of licensee product to be used only in conjunction with a Cypress integrated circuit as specified in the applicable agreement Any reproduction modification translation compilation...

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