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6.1.2 Built-in Punch connec on
Chapter 6: Op onal Devices
6.1Built-in Punching
6.1.1 Built-in Punching structure
6.2 BGP Punch Bridge
6.2.1BGP Punch Bridge structure
6.1.3 Built-in Punch se ngs
6.1.4 Built-in Punching maintenance
Reserved notch
Die punch components
Chuds removal tube
Die punch
Air Cylinder
BGP Interface port connec on
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Built-in punching is an op onal peripherals, it is a module that can be integrated onto CTP equipment, to
provide precise registra on on punching while having plat mounted at a same posi on for imaging.
a) Click the "Op ons" on the LaBoo so ware main interface to call up the "External Setup" dialog box and click
on the "Punch Bridge" tap for se ngs;
b) Select "Embedded Punching" in the first pull-down menu field, then put a ck on the "Enable Bridge” check
box;
c) There is no need to select “Bridge Type” and you may leave the lower parameter fields as default (fields will
be gray out).
a) Device with built-in punching featurerequires proper setup of “Punch Bridge” se ngs in Template Upload in
order to have built-in punching working accordingly;
b)In the Template se ngs, click on the “BGP” to enable the “Punch Bridge” tab under the Template edit mode,
on the Device Code field: select “Embedded punching”;
c) For plate Entrance direc on, or Exit direc on: No need to set or apply if using “Embedded punching”.
d) Mold selec on (Die punch): select the correspondent Die Punch set for used with the current working
template, only one set of Punching can be used or applied in each Template. (Each CTP device can have maximum
up to 3 sets of Punching mold installa on);
a) Regularly inspects for aluminum chuds remains, clean and repair die mold if necessary to extend its life spend
b) Regularly check the air cylinder support rod for lubrica on and sealing condi ons
c) Replace cylinder seals every 24 months
BGP Punch Bridge is an op onal peripheral. It can be linked with a CRON CTP device for automa c
registra on and plate holes punching according to template se ngs. Main func ons of BGP Punch Bridge are:
Able to automa c carry out plate registra on and plate holes punching according to plate specifica ons used on
the CTP. Allow 4 direc ons of plate media delivery depend on devices layout. And can be directly joint with a
plate processor equipment.
Punch moldcover
Die punch components (internal)
Electrical box
BGP Interface port connec on
Le -right conveyorbelts
Front-back sending rollers
6.2.2BGP Punch Bridge connec onConnect the BGP Punch Bridge communica on cable(CAN BUS) on both the
BGP interface port connectors on the CTP device and on the BGP Punch Bridge.
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SIMPLE AND DIRECT 丨 STEADY 丨 MAJOR SIMPLE AND DIRECT
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STEADY
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MAJOR