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6
HIGH‑BRIGHTNESS LED SOLDERING & HANDLING
•
The temperature profile (3) is as below (for UHD1110‑FKA products):
Solder
Average ramp-up rate
4 ºC/second max.
Preheat time
120 seconds max.
Soak temperature
155 ºC ‑ 175 ºC
Soak time
60-100 seconds max.
Peak temperature
235 ºC ‑ 245 ºC max.
Duration above 217 ºC
60 seconds max.
Ramp-down rate
6 ºC/second max.
The units in the graphs below are in millimeters (mm).
LM1 series
recommended solder-pad design for heat dissipation:
Melting point
Temper
atur
e
Time
Pre-heat
Cooling
Reflow
Soak
5/13
The unit is millimeter (mm) in the graphs below.
LM1 series recommended solder pad design for heat dissipation:
7.5
0.5
7.0
2.6
4.5
1.5
1.5
LM4 & LM2 series recommended solder pad design for heat dissipation:
7.5
0.5
7.
0
0.
4
4.5
1.5 1.5
2.
6
1.
1
LV1 & LA1 & LVB series recommended solder pad design for heat dissipation:
9.5
1.5
2.5
2.5
0.5
7.
0
0.
4
0.
5
3.
3
1.
65
2.
6
1.
1
4.5
1.5 1.5
LP6 series recommended solder pad design for heat dissipation:
5/13
The unit is millimeter (mm) in the graphs below.
LM1 series recommended solder pad design for heat dissipation:
7.5
0.5
7.0
2.6
4.5
1.5
1.5
LM4 & LM2 series recommended solder pad design for heat dissipation:
7.5
0.5
7.
0
0.
4
4.5
1.5 1.5
2.
6
1.
1
LV1 & LA1 & LVB series recommended solder pad design for heat dissipation:
9.5
1.5
2.5
2.5
0.5
7.
0
0.
4
0.
5
3.
3
1.
65
2.
6
1.
1
4.5
1.5 1.5
LP6 series recommended solder pad design for heat dissipation: