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Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree

®

 is a registered trademark and the Cree logo is a trademark of Cree, Inc.

11

HIGH‑BRIGHTNESS LED SOLDERING & HANDLING

LMU series

 recommended solder-pad design for heat dissipation:

LMX series

 recommended solder pad design for heat dissipation:

8/13 

          

0.8

0.8

1.9

2.5

1

1

 

 
 

  LMU series recommended solder pad design for heat dissipation: 

                              

           

0.

8

0.

8

1.

9

2.5

1

1

 

 

  LV6 series recommended solder pad design for heat dissipation: 

                                            

 

                                         

1.

7

5.

65

1.

3

1.

7

0.

47

5

8.2

2.7

2.8

 

 

 

  LX6 series recommended solder pad design for heat dissipation: 

 

9/15

 

 

 

LMX series recommended solder pad design for heat dissipation:

 

 

                            

7.5

0.5

7.0

0.3

3.3

0.9 1.5

1.9

0.8

 

 

 

LV6 series recommended solder pad design for heat dissipation:

 

                                             

                                         

1.7

5.65

1.3

1.7

0.475

8.2

2.7

2.8

 

 

 

 

LX6 series recommended solder pad design for heat dissipation:

 

 

                    

 

 

 

 

 

Содержание LS8

Страница 1: ...ic power and the way the LEDs are mounted Ultrasonic cleaning should be pre qualified to ensure this will not cause damage to the LEDs 2 Forming When forming leads the leads should be bent at a point at least 3 mm from the base of the package Don t form the leads during or after soldering If forming is required this must be done before soldering Avoid any bending stress to the LED package during l...

Страница 2: ...ring is as below Different lead free solder requires different solder conditions Please contact us for details Do not apply any stress to the LED package particularly when heated It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by the LEDs The LEDs must not be re used once they have been extracted from PCB After soldering the LEDs the package should be ...

Страница 3: ...not exceed the absolute maximum rating The power of high brightness LEDs is very strong and may injure human eyes Precautions must be taken such as avoiding looking directly into lit LEDs SMD LEDS 1 Cleaning Don t use unspecified chemical liquids to clean an SMD LED the chemical could harm the SMD LED When washing is necessary please wipe the LED with alcohol at normal room temperature and dry at ...

Страница 4: ...be done more than two times according to model s MSL requirements a Manual soldering by soldering iron Since the temperature of manual soldering is not stable manual soldering by soldering iron is not recommended If manual soldering is necessary the use of a soldering iron of less than 25 W is recommended and the temperature of the iron must be kept below 315 ºC with soldering time within 2 second...

Страница 5: ... peak temperature 10 seconds max Duration above 217 ºC 60 seconds max The temperature profile 2 is as below for SMD LED CLMVB DKA CLMVB FKA CLMVC FKA CLMVC FKC CLMUC FKA CLMUD FKA CLP6C FKB CLV1S FKB CLV6A FKB CLX6A FKB CLVBA FKA CLY6C FKC CLY6D FKC CLYBA FKA CLYBB FKA and other products not listed herein Solder Average ramp up rate 4 ºC second max Preheat temperature 150 ºC 200 ºC Preheat time 12...

Страница 6: ...217 ºC 60 seconds max Ramp down rate 6 ºC second max The units in the graphs below are in millimeters mm LM1 series recommended solder pad design for heat dissipation Melting point Temperature Time Pre heat Cooling Reflow Soak it is millimeter mm in the graphs below eries recommended solder pad design for heat dissipation 7 5 0 5 7 0 2 6 4 5 1 5 1 5 LM2 series recommended solder pad design for hea...

Страница 7: ...7 0 0 4 0 5 3 3 1 65 2 6 1 1 4 5 1 5 1 5 LP6 series recommended solder pad design for heat dissipation 5 13 7 5 0 5 4 5 1 5 1 5 LM4 LM2 series recommended solder pad design for heat dissipation 7 5 0 5 7 0 0 4 4 5 1 5 1 5 2 6 1 1 LV1 LA1 LVB series recommended solder pad design for heat dissipation 9 5 1 5 2 5 2 5 0 5 7 0 0 4 0 5 3 3 1 65 2 6 1 1 4 5 1 5 1 5 LP6 series recommended solder pad desig...

Страница 8: ... SMD LS8 series recommended solder pad design for heat dissipation A6 series recommended solder pad design for heat dissipation Note Metal area at 1 2 3 should not be less than 40mm 2 each for sufficient heat dissipation 1 3 4 0 9 3 1 3 2 2 1 55 4 4 1 0 0 9 1 4 3 8 1 0 Note Metal area at 1 2 3 should not be less than 16mm 2 each for sufficient heat dissipation 6 13 1 6 0 5 2 0 4 5 3 2 A 6 6 2 0 LU...

Страница 9: ...n LB6 series recommended solder pad design for heat dissipation 0 8 0 7 0 8 2 9 0 3 4 5 1 5 1 5 LB6 series recommended solder pad design for heat dissipation 1 5 1 4 1 5 5 2 0 4 7 4 1 8 3 8 LT6 series recommended solder pad design for heat dissipation 2 7 0 65 2 6 7 0 85 1 0 0 3 0 8 0 7 0 8 2 9 0 3 4 5 1 5 1 5 LB6 series recommended solder pad design for heat dissipation 1 5 1 4 1 5 5 2 0 4 7 4 1 ...

Страница 10: ...ESS LED SOLDERING HANDLING LT6 series recommended solder pad design for heat dissipation LMV series recommended solder pad design for heat dissipation 7 13 LT6 series recommended solder pad design for heat dissipation LMV series recommended solder pad design for heat dissipation 2 7 0 65 2 6 0 7 0 85 1 0 0 3 0 8 0 8 1 9 2 5 1 1 LMU series recommended solder pad design for heat dissipation 0 8 0 8 ...

Страница 11: ...MX series recommended solder pad design for heat dissipation 8 13 LMU series recommended solder pad design for heat dissipation 0 8 0 8 1 9 2 5 1 1 LV6 series recommended solder pad design for heat dissipation 1 7 5 65 1 3 1 7 0 475 8 2 2 7 2 8 LX6 series recommended solder pad design for heat dissipation LMX series recommended solder pad design for heat dissipation 7 5 0 5 7 0 0 3 3 3 0 9 1 5 1 9...

Страница 12: ...NESS LED SOLDERING HANDLING LV6 series recommended solder pad design for heat dissipation LX6 series recommended solder pad design for heat dissipation 8 13 LV6 series recommended solder pad design for heat dissipation 1 7 5 65 1 3 1 7 0 475 8 2 2 7 2 8 LX6 series recommended solder pad design for heat dissipation LY6 series recommended solder pad design for heat dissipation 1 6 1 8 5 0 2 8 0 35 0...

Страница 13: ...trademark of Cree Inc 13 HIGH BRIGHTNESS LED SOLDERING HANDLING LY6 series recommended solder pad design for heat dissipation LS6 series recommended solder pad design for heat dissipation LY6 series recommended solder pad design for heat dissipation LS6 series recommended solder pad design for heat dissipation 1010 series recommended solder pad design for heat dissipation ...

Страница 14: ...he package during soldering The package may be affected by environments assemblies which contain corrosive substance Please avoid conditions which may cause the LEDs to corrode tarnish or discolor The PCB should not be wrapped after soldering to allow natural cooling down to 40 10 15 1010 series recommended solder pad design for heat dissipation Modification of an SMD LED is not recommended after ...

Страница 15: ...he product s surface and interior device it is recommended to choose a special nozzle to pick up the SMD products during the process of SMT production If handling is necessary take special care when picking up these products The following two methods are necessary Fig 1a For Small Top SMD Fig 1b For Mini slde 0 8 mm SMD For UHD1110 FKA touch the package by hand is not suggested and avoid scratch o...

Страница 16: ...on the product label If the shelf life is over 12 months re baking is required 2 Record the lot number of the SMD product to aid investigation 3 Avoid external damage to the packaging bag after product is taken out of the box For example many SMD products are stacked without box re packing with bubble plastic bag for protection is recommended 4 Recommendation for product opening and storage use sc...

Страница 17: ...bag has an air leak 3 The humidity indication card has color change at 30 RH at the time of opening the vacuum sealed bag 4 The vacuum sealed bag has been opened but the steps listed under Notice items after opening the bag above have not been followed Color change Normal 3 The product should be used within MSL level floor time 4 If SMD products can t be used up within MSL level floor time they sh...

Страница 18: ...ld cool down to 40 ºC in the oven before being removed for use 6 Electrostatic Discharge and Electrical Overstress Electrostatic discharge ESD or electrical overstress EOS may damage an SMD LED Precautions such as ESD wrist straps ESD shoe straps or antistatic gloves must be worn whenever handling SMD LEDs All devices equipment and machinery must be properly grounded It is recommended to perform e...

Страница 19: ... HANDLING 8 SMD Screen Product Moisture Sensitivity Level Product Family P N Moisture Sensitivity Level SMD LEDs CLA1 series 5a CLA2 series CLM1 series CLM2 series CLM3 series CLM4 series CLMU series CLMV series CLMX series CLP6 series CLS8 series CLU6 series CLV1 series CLV6 series CLVB series CLX6 series CLY6 series CLYB series CLQ6 series UHD1110 series The information in this document is subje...

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