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10
HIGH‑BRIGHTNESS LED SOLDERING & HANDLING
LT6 series
recommended solder-pad design for heat dissipation:
LMV series
recommended solder-pad design for heat dissipation:
7/13
0.
8
0.
7
0.
8
2.
9
0.
3
4.5
1.5 1.5
LB6 series recommended solder pad design for heat dissipation :
1.
5
1.
4
1.
5
5.
2
0.
4
7.4
1.8
3.8
LT6 series recommended solder pad design for heat dissipation
:
LMV series recommended solder pad design for heat dissipation
:
2.7
0.6
5
2.6
0.7
0.85
1.0
0.3
8/13
0.8
0.8
1.9
2.5
1
1
LMU series recommended solder pad design for heat dissipation:
0.
8
0.
8
1.
9
2.5
1
1
LV6 series recommended solder pad design for heat dissipation:
1.
7
5.
65
1.
3
1.
7
0.
47
5
8.2
2.7
2.8
LX6 series recommended solder pad design for heat dissipation: