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HIGH‑BRIGHTNESS LED SOLDERING & HANDLING
5. Important Notes (Small‑top, Mini‑side 0.8‑mm SMD Products and UHD1110‑FKA)
•
The packaging sizes of these SMD products are very small and the resin is still soft after solidification. Users are required to handle
with care. Never touch the resin surface of SMD products.
•
To avoid damaging the product’s surface and interior device, it is recommended to choose a special nozzle to pick up the SMD
products during the process of SMT production. If handling is necessary, take special care when picking up these products. The
following two methods are necessary:
Fig. 1a: For Small Top SMD
Fig. 1b: For Mini‑slde 0.8 mm SMD
For UHD1110‑FKA, touch the package by hand is not suggested and avoid scratch on device surface:
Fig. 1c: For UHD1110‑FKA
•
SMT nozzle
For example: CLA1B
For silicone-covered SMD LEDs, it is recommended to use non-metallic nozzles. Cree and several of Cree’s customers have had
success using nozzles fabricated from Teflon or from 90d urethane.
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6. Electrostatic Discharge and Surge current
7. Heat Management