Thank you for the trust you have shown in our company
through your purchase of the Weller CSF desoldering head.
Production was based on very stringent quality require-
ments, which guarantee perfect functioning of the unit.
1. Important!
If the equipment is used for purposes other than those des-
cribed in the Operating Instructions, or unauthorised modifi-
cations are made, the manufacturer shall not be liable in the
event of damage or injury.
Safety Instructions
1. Caution! Risk of burns!
Even after switching off, or removal, the soldering head still
requires time to cool down
2. When not in use, always deposit desoldering irons in
the original rest.
3. Never leave combustible materials near the hot solde-
ring iron.
The Operating Instructions of the control unit used, and in
particular the warning notes, are applicable as a supplement
to these Operating Instructions.
2. Description
CSF soldering heads were specially developed for desolde-
ring SMT components. The transfer of heat is by means of
contact heat. This is why it is important that the soldering
head fits exactly. A CSF soldering head requires both a suita-
ble adapter and a suction element for lifting the components.
These are not included in the scope of delivery and must be
ordered specially for the Weller desoldering iron used.
3. Initial operation
Release the headless pin at the adapter and insert the CSF
soldering head into the adapter. The optimum position of the
CSF can be set by turning the soldering head in relation to
the adapter. Then retighten the headless pin.
The suction element must contact the component surface
when the hot bar contacts the connecting leg. Test this pro-
cedure with a cold CSF before starting your soldering work.
Remove excessive tin solder from the hot bar by briefly hea-
ting up the desoldering iron before starting work. If the suc-
tion element is too long at the shaft end, cut off accordingly;
if it is too short, it can be pulled out slightly, otherwise use a
new suction element.
Important:
Change or adjust the suction element only when it is
cold.
Observe the edge distance to surrounding components
(check with cold CSF). Interfering components must be
removed beforehand if necessary.
Temperature adjustment
Stand-by temperature:
220°C
Maximum temperature:
310°C
The stand-by temperature is suitable for continuous opera-
tion, whereas higher temperatures should be used for a short
time only as otherwise the suction will turn brittle. Apply an
ample amount of tin to the edges during the heating-up pro-
cess (the insides on CSF-QI). Non-wetted areas, burnt solde-
ring flux or tin drops have a negative effect on the result.
4. Desoldering process
Place the printed circuit board on a flat surface, best of all on
a firm plate of foamed material (lowest heat dissipation).
When the working temperature has been reached, press the
CSF on the components, and switch on the vacuum. In order
to check whether the component connections have molten,
lift the component.
5. Advice on desoldering
- Component is glued on: crack the splice when heated by
turning the component with the CSF.
- Use the suction nozzle to remove excessive soldering tin
after the desoldering process.
CSF-type page 16/17
Subject to technical alterations and amendments!
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English
