Xtreme/GbE - Managed Carrier Ethernet Switch
Users Guide
Document: CTIM-00429
Revision: 0.11
Page 27 of 31
Date: 2021-01-05
THERMAL DETAILS
XDG Thermal Parameters
Thermal Parameter
Value
Minimum Ambient Operating Temperature
-40 °C
Maximum Operating Junction Temperature
125 °C
Recommended XDG TDP
8W
Die junction to package case top
3.27 °C/W
Die junction to PCB
6.03 °C/W
Die junction to Ambient
12.14 °C/W
Die junction to moving air @ 1 m/s
9.42 °C/W
Air Cooled Heatsinks
All air-cooled models of the XDG ship with a black anodized 28x28x6.35mm Heatsink.
Part Number: 658-25ABT3
Manufacture: Wakefield-Vette
Thermal Resistance @ Forced Air Flow: 5°C/W @ 500 LFM
Conduction Cooled Heatplate
All conduction cooled models of the XDG ship with the
XHG101
heatplate. This heatplate has an outer
dimensions that are equal to the PC/104 form factor of 3.775” x 3.550”, with a height of 0.435”.
Detailed Mechanical Drawings upon request: [email protected]