110
DS1113F1
CS4399
11 Thermal Characteristics
11 Thermal Characteristics
Notes:
• Natural convection at the maximum recommended operating temperature T
A
(see
)
• Four-layer, 2s2p PCB as specified by JESD51-9 and JESD51-11; dimensions: 101.5 x 114.5 x 1.6 mm
• Thermal parameters as defined by JESD51-12
12 Ordering Information
13 References
• NXP Semiconductors,
The I
2
C-Bus Specification and User Manual (UM10204)
. http://www.nxp.com/
14 Revision History
Table 11-1. Typical JEDEC Four-Layer, 2s2p Board Thermal Characteristics
Parameter Symbol
WLCSP
QFN
Units
Junction-to-ambient thermal resistance
JA
42.3
32.7
°C/W
Junction-to-board thermal resistance
JB
11.1
8.8
°C/W
Junction-to-case thermal resistance
JC
0.22
0.92
°C/W
Junction-to-board thermal-characterization parameter
JB
11.0
8.8
°C/W
Junction-to-package-top thermal-characterization parameter
JT
0.09
0.23
°C/W
Table 12-1. Ordering Information
Product Description
Package
Halogen
Free
Pb Free
Grade
Temperature
Range
Container
Order Number
CS4399 130-dB, 32-Bit
42-ball
WLCSP
Yes
Yes
Commercial –10°C to +70°C Tape and Reel
CS4399-CWZR
40-pin
QFN
Yes
Yes
Commercial –10°C to +70°C
Tray
CS4399-CNZ
Tape and Reel
CS4399-CNZR
Table 14-1. Revision History
Revision
Changes
F1
DEC ‘16
Initial release
Important
: Please check with your Cirrus Logic sales representative to confirm that you are using the latest revision of this document and to
determine whether there are errata associated with this device.