Cavli Wireless C100QM/C10QM Hardware Manual
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lower than 30 degrees Celsius and the air humidity is less than 60%, the factory can
complete the patch within 72 hours, and the module can directly perform reflow
soldering or other high temperature process.
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If the module is in other conditions, it needs to be baked before the patch.
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If the module needs to be baked, remove the module and bake for 48 hours at 125
degrees Celsius (allowing fluctuations of up to 5 degrees Celsius).
7.3 Production welding
The C100QM/C10QM module is packaged in an anti-static tray. The SMT wire body
needs to be equipped with a Tray module. It is recommended to use a reflow oven above
7 temperature zones.
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To ensure the quality of the module paste, the thickness of the stencil corresponding
to the pad portion of the C100QM/C10QM module is recommended to be 0.18 mm.
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The recommended reflow temperature is 235~245oC, which cannot exceed 260oC.
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When the PCB is laid out on both sides, the LGA module layout must be machined on
the 2nd side. Avoid module falling parts, welding and welding, and poor internal
welding of the module caused by the gravity of the module.
The recommended furnace temperature curve is shown below: