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- Technical Information Manual
20
Moisture Sensitive Level 3 (MSL 3)
CAEN RFID srl follows JEDEC standards for moisture classifications. The Lepton
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R7100C RFID reader is
classified as MSL 3.
Y
Warning
: The damaging effects of moisture absorbed in semiconductor packages during SMT
assembly are known. Pay attention to the next paragraphs and follow the instructions to avoid
problems.
MSL 3 Handling at PCB Assembly
The Lepton
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R7100C package is moisture sensitive and needs to be handled within proper MSL 3 guidelines
to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield
and reliability degradation.
A.
During PCB Assembly
1.
Devices are baked and dry-packed before shipment from CAEN RFID. The packing uses a
Moisture Barrier Bag (MBB). A Humidity Indicator Card (HIC) and drying desiccant are included
inside the MBB. A MSL 3 label is attached to caution that the bag contains moisture sensitive
devices.
2.
Shelf life of devices in a sealed bag is 12 months at <40ºC and <90% room humidity (RH).
3.
Upon opening of MBB, the HIC should be checked immediately; devices require baking before
board mounting if the HIC is >10% when read at 23ºC ± 5ºC.
4.
After MBB is opened, devices should go through reflow for board assembly within 168 hours at
factory conditions of <30ºC/60% RH, or stored at <10% RH. If both conditions are not met,
baking is required before board mounting.
5.
If baking is required, devices should be baked for a minimum of 48 hours at 125ºC or 24 hours
at 150°C.
B.
Handling Unused Devices
1.
Any unused devices after the MBB have been opened for more than 168 hours or not stored at
<10% RH should be baked before any subsequent reflow and board assembly.
2.
Re-baking should be done for a minimum of 48 hours at 125ºC or 24 hours at 150°C.
3.
Unused devices can either be baked and dry-packed first before storage, or they can be baked
just before the next board assembly. It is recommended that the former be practiced as it helps
to prevent operator error from re-using devices without baking. In both cases, the re-packed
materials should follow the guidelines in section A.
C.
Reworking a Device on a PCB
1.
Before a device is removed from the module, the module must first be baked.
2.
Baking should be done for a minimum of 48 hours at 125ºC or 24 hours at 150°C.
3.
It is recommended that during removal, localized heating be used, and the maximum body
temperature of device should not exceed 200ºC.
4.
The replacement device should not exceed the specified floor life of 168 hours.
