BenQ 9H.Y1277.000, Руководство по обслуживанию изделия

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7. AL, HSG ILL and HSG DMD Assembly:
7.1 Placed “AL” on the “HSG DMD”. The “raised surface” of “AL” shall toward “DMD direction” (Fig.
7-1).
7.2 To assemble ”HSG ILL SUB Module” with “HSG DMD” and cover over on “AL” and the then lock
with screws(Fig. 7-2).
Fig. 7-1 Fig. 7-2
8. DMD and Chip B/D Module:
8.1. Judge Chip B/D and DMD alignment keying first (Fig. 8-1, 8-2).
8.2. Alight keying and Assemble DMD to Chip B/D (Fig. 8-3).
8.3. Push DMD slightly and use screwdriver rotate clockwise button to lock (close notation) DMD on
Chip B/D (Fig. 8-4).
Fig. 8-1 Fig. 8-2
AL
DMD Direction
8F.1A723.5R0
Fixed shafts& holes
Alignment keying