18
EESX20 and EESX30
Release 1.5 04/2020
2.1.2
Components to be cooled on EESX-Module
The following ICs should be cooled if the permissible case temperature will be exceeded.
(See Chapter
Technical Data
for case temperature.)
Component
x-direction / mm
y-direction / mm
IC401
28
28
IC901
17,5
17,5
IC902
14
8
IC1002
6
8
IC602
(EESX30 only)
12,2
12,2
IC202
6,82
4,5
IC203
7
4,5
IC205
4,5
7
Table 2-1: Dimensions of ICs to be cooled on EESX-Module (related to Figure 2-4)
Component positions on ESSX board for a heat sink
In the picture below are the positions of the components on EESX board which should be connected to a
heat sink for cooling.
Figure 2-4: Positions of ICs to be cooled on EESX-Module TOP VIEW
Component heights on ESSX board for a heat sink
Component
Height (min.)
Height (nominal)
Height
(max.)
IC401
2.20 mm
2.33 mm
2.52 mm
IC901
Not available
Not available
1.60 mm
IC902
Not available
Not available
1.20 mm
IC1002
0.70 mm
0.75 mm
0.80 mm
IC202, IC203, IC205
1.05 mm
1.1 mm
1.15 mm
IC602
(EESX30 only)
Not available
Not available
1,78 mm
Table 2-1: Component heights of ICs to be cooled on EESX-Module
According to supplier's data sheets. Recommended additional tolerance: 0.4 mm.