Beckhoff CP22 Series, Руководство пользователя

Страница: 37 / 53

Maintenance
CP22xx 37 Version: 2.0
7 Maintenance
CAUTION
Risk of electric shock
Working on the Panel PC when live can lead to electric shock.
• Turn off the supply voltage before cleaning the device or replacing device components. Excluded from
this is the replacement of hard disks and SSDs in RAID configuration and fan cartridges.
Maintenance measures increase the efficiency of the device by ensuring long-term functionality. Cleaning
and maintenance of certain device components and the replacement of other device components contribute
to this.
7.1 Cleaning
NOTE
Unsuitable cleaning agents
The use of unsuitable cleaning agents can damage the device.
• Clean the Panel PC only as specified.
It is essential to observe the following points when cleaning the PC:
• Keep to the boundary conditions of protection rating IP65/IP20.
• Never use compressed air to clean the PC.
• Maintain an ambient temperature range of 0 °C to 55 °C.
Cleaning agents
In order to avoid damage to the front of the Panel PC during cleaning, you must use suitable cleaning
agents. Examples include:
• benzine
• spirit
• acetone
• glass cleaner
Avoid the following cleaning agents:
• Detergents with scouring or abrasive components
• Metal cleaning objects such as razor blades or steel spatulas
• Steam jet cleaner or very hot water
• Cold water with a heated device
• High water pressure, e.g. high-pressure cleaner
Cleaning the front screen
You can clean the front screen of the Panel PC during operation. In order to avoid inadvertent touch entries
when doing this, you must first set the device to "Cleaning Mode" with the help of the Beckhoff Control Tool.
The Beckhoff Control Tool does not start automatically when the PC starts up. Proceed as follows to activate
the "Cleaning Mode" of the Beckhoff Control Tool:
1. Click the Beckhoff Control Tool to start it.
ð When the tool is started, a small sun symbol appears in the taskbar.
2. Right-click the sun symbol.
3. Select the "Cleaning Mode" (see Fig. 23).