Overview
CB3067
11
Version: 1.0
4.3
Specifications and documents
The following documents, specifications or webpages were used for the preparation of this manual or as
further technical documentation respectively.
•
PCI specification
• Version 2.3 or 3.0
• www.pcisig.com
•
PCI Express® Base Specification
• Version 5.0
• www.pcisig.com
•
ACPI specification
• Version 5.0
• www.acpi.info
•
ATA/ATAPI specification
• Version 7 Rev. 1
• www.t13.org
•
USB specifications
• www.usb.org
•
SM-Bus specification
• Version 2.0
• www.smbus.org
•
Intel® chip descriptions
• Intel® Core™ processor product family data sheet
• www.intel.com
•
Intel® chip description
• I219 data sheet
• i210 datasheet
• www.intel.com
•
SMSC® chip description
• SCH3114 datasheet (NDA required)
• www.smsc.com
•
American Megatrends®
• Aptio™ Text Setup Environment (TSE) User Manual
• www.ami.com
•
American Megatrends®
• Aptio™ 5.x Status Codes
• www.ami.com
Содержание CB3067
Страница 1: ...Original manual EN CB3067 Computerboard 12 10 2020 Version 1 0...
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Страница 97: ...Mechanical drawing CB3067 97 Version 1 0 9 2 PCB Holes Fig 19 CB3067 MZ MH...
Страница 99: ...Mechanical drawing CB3067 99 Version 1 0 Fig 22 CB3067 Cooling Bottom...
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Страница 108: ...Beckhoff Automation GmbH Co KG H lshorstweg 20 33415 Verl Germany Phone 49 5246 9630 info beckhoff com www beckhoff com...