Beckhoff CB3067, Оригинальное руководство

Страница: 101 / 108

Technical data
CB3067 101 Version: 1.0
10.3 Thermal specifications
The board is specified for an ambient temperature range from 0°C to +60°C (extended temperature range on
request). In addition, care must be taken that the temperature of the processor die does not exceed 100 °C.
To ensure this a suitable cooling concept must be implemented that is oriented to the maximum power
consumption of the processor/chipset. It must also be ensured that any existing controllers are included in
the cooling concept. The power consumption of these function blocks may be of the same order of
magnitude as the power consumption of the processor.
The board is prepared with drill holes for the use of suitable cooling solutions. We have a series of
compatible cooling components in our range. Your distributor will be pleased to assist you in selecting
suitable solutions.
NOTE
Prevent the maximum die temperature being exceeded!
It is the end customer's responsibility to ensure that the die temperature of the processor does not exceed
100 °C! Continuous overheating can destroy the board!
If the temperature exceeds 100 °C, the ambient temperature needs to be reduced. Ensure sufficient air cir-
culation if necessary.