AXIOMTEK CEB94022, Руководство пользователя

Страница: 9 / 50

CEB94022 COM Express
TM
Type 6 with MXM Application Board
Introduction 3
 Digital I/O
 Four inputs and four outputs in wafer connector.
 Display
 One 2x20-pin connector for 18/24-bit single/dual channel LVDS and one 8-pin
inverter connector. LVDS resolution is up to 1920x1200 in 24-bit dual channels.
 One 16-pin wafer connector as VGA interface.
 Five DP connectors (one DP from COM Express
TM
, four DP from MXM).
 One HDMI connector (from COM Express
TM
)
 Expansion Interface
 Two full-size PCI-Express Mini Card sockets which comply with PCI-Express Mini
Card Spec. V1.2.
 Power Input
 DC 19V~24V.

Battery
 Lithium 3V/220mAH.
 Size
 245 x 190mm.
 Board Thickness
 1.6mm.
 Operation Temperature
 -20°C ~ +65°C (-68°F ~ 149°F).

Operation Humidity
 10% ~ 95% relative humidity, non-condensing.
Note

All specifications and images are subject to change without notice.

Before using the COM Express
TM
baseboard, check with your supplier if the
BIOS on COM Express
TM
module supports this baseboard.
1.3 Utilities Supported
 Audio driver
 Intel
®
Ethernet driver