AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
18
13.4 8MA2 — 8-pad UDFN
DRAWING NO.
REV.
TITLE
GPC
8MA2
G
11/26/14
8MA2, 8-pad 2 x 3 x 0.6mm Body, Thermally
Enhanced Plastic Ultra Thin Dual Flat No-Lead
Package (UDFN)
YNZ
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
A
0.50
0.55
0.60
A1
0.0
0.02
0.05
A2
-
-
0.55
D
1.90
2.00
2.10
D2
1.40
1.50
1.60
E
2.90
3.00
3.10
E2
1.20
1.30
1.40
b 0.18
0.25
0.30
3
C
1.52 REF
L
0.30
0.35
0.40
e
0.50 BSC
K
0.20
-
-
TOP VIEW
SIDE VIEW
BOTTOM VIEW
Package Drawing Contact:
C
E
Pin 1 ID
D
8
7
6
5
1
2
3
4
A
A1
A2
D2
E2
e (6x)
L (8x)
b (8x)
Pin#1 ID
K
1
2
3
4
8
7
6
5
Notes:
1. This drawing is for general information only. Refer to
Drawing MO-229, for proper dimensions, tolerances,
datums, etc.
2. The Pin #1 ID is a laser-marked feature on Top View.
3. Dimensions b applies to metallized terminal and is
measured between 0.15 mm and 0.30 mm from the
terminal tip. If the terminal has the optional radius on
the other end of the terminal, the dimension should
not be measured in that radius area.
4. The Pin #1 ID on the Bottom View is an orientation
feature on the thermal pad.
