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AT24C16C [DATASHEET]

Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016

12.

Ordering Information

Note:

For Wafer sales, please contact Atmel Sales.

Atmel Ordering Code

Lead Finish

Package

Delivery Information

Operation

Range

Form

Quantity

AT24C16C-SSHM-B

NiPdAu

(Lead-free/Halogen-free)

8S1

Bulk (Tubes)

100 per Tube

Industrial

Temperature

(-40



C to 85



AT24C16C-SSHM-T

Tape and Reel

4,000 per Reel

AT24C16C-XHM-B

Bulk (Tubes)

100 per Tube

AT24C16C-XHM-T

Tape and Reel

5,000 per Reel

AT24C16C-MAHM-T

8MA2

Tape and Reel

5,000 per Reel

AT24C16C-MAHM-E

Tape and Reel

15,000 per Reel

AT24C16C-PUM

Matte Sn

(Lead-free/Halogen-free)

8P3

Bulk (Tubes)

50 per Tube

AT24C16C-STUM-T

5TS1

Tape and Reel

5,000 per Reel

AT24C16C-CUM-T

SnAgCu

(Lead-free/Halogen-free)

8U3-1

Tape and Reel

5,000 per Reel

AT24C16C-MEHM-T

N/A

8ME1

Tape and Reel

5,000 per Reel

AT24C16C-WWU11M

(1)

N/A

Wafer Sale

Note 1

Package Type

8P3

8-lead, 0.300" wide, Plastic Dual Inline Package (PDIP)

8S1

8-lead, 0.150" wide, Plastic Gull Wing Small Outline (JEDEC SOIC)

8-lead, 4.40mm body, Plastic Thin Shrink Small Outline Package (TSSOP)

8MA2

8-pad, 2.00mm x 3.00mm body, 0.50mm pitch, Plastic Ultra Thin Dual Flat No Lead (UDFN)

8ME1

8-lead, 1.80mm x 2.20mm body, 0.40mm pitch, Extra Thin Dual Flat No Lead (XDFN)

5TS1

5-lead, 2.90mm x 1.60mm body, Plastic Thin Shrink Small Outline (SOT23)

8U3-1

8-ball, 1.50mm x 2.00mm body, 0.50mm pitch, Die Ball Grid Array (VFBGA)

Содержание AT24C16C

Страница 1: ... Green Package Options Pb Halide free RoHS Compliant 8 lead PDIP 8 lead SOIC 8 lead TSSOP 8 pad UDFN 8 pad XDFN 5 lead SOT23 and 8 ball VFBGA Die Options Wafer Form and Tape and Reel Description The Atmel AT24C16C provides 16 384 bits of Serial Electrically Erasable and Programmable Read Only Memory EEPROM organized as 2 048 words of 8 bits each The device is optimized for use in many industrial a...

Страница 2: ...VCC WP SCL SDA NC NC NC GND 1 2 3 4 8 7 6 5 8 lead TSSOP 1 2 3 4 8 7 6 5 NC NC NC GND VCC WP SCL SDA 8 lead SOIC NC NC NC GND VCC WP SCL SDA 1 2 3 4 8 7 6 5 Operating Temperature 55 C to 125 C Storage Temperature 65 C to 150 C Voltage on any pin with respect to ground 1 0V to 7 0V Maximum Operating Voltage 6 25V DC Output Current 5 0mA Notice Stresses beyond those listed under Absolute Maximum Rat...

Страница 3: ... single bus to one see Section 7 Device Addressing on page 9 Write Protect WP AT24C16C has a Write Protect pin that provides hardware data protection The Write Protect pin allows normal Read Write operations when connected to Ground GND When the Write Protect pin is connected to VCC the Write Protection feature is enabled and operates as shown in Table 4 1 Table 4 1 Write Protect Start Stop Logic ...

Страница 4: ...ions CI O Input Output capacitance SDA 8 pF VI O 0V CIN Input capacitance A0 A1 A2 SCL 6 pF VIN 0V Applicable over recommended operating range from TAI 40 C to 85 C VCC 1 7V to 5 5V unless otherwise noted Symbol Parameter Test Condition Min Typ Max Units VCC1 Supply Voltage 1 7 5 5 V ICC Supply Current VCC 5 0V Read at 100kHz 0 4 1 0 mA ICC Supply Current VCC 5 0V Write at 100kHz 2 0 3 0 mA ISB1 S...

Страница 5: ...se Width Low 1 2 0 4 μs tHIGH Clock Pulse Width High 0 6 0 4 μs tI Noise Suppression Time 100 50 ns tAA Clock Low to Data Out Valid 0 1 0 9 0 05 0 55 μs tBUF Time the bus must be free before a new transmission can start 1 2 0 5 μs tHD STA Start Condition Hold Time 0 6 0 25 μs tSU STA Start Condition Setup Time 0 6 0 25 μs tHD DAT Data In Hold Time 0 0 μs tSU DAT Data In Setup Time 100 100 ns tR In...

Страница 6: ... or Stop Condition as defined below Figure 6 1 Data Validity Start Condition A high to low transition of SDA with SCL high is a Start Condition which must precede any other command Stop Condition A low to high transition of SDA with SCL high is a Stop Condition After a read sequence the Stop Condition command will place the EEPROM in a standby power mode Figure 6 2 Start Condition and Stop Conditi...

Страница 7: ...ternal operations 2 wire Software Reset After an interruption in protocol power loss or system reset any 2 wire part can be reset by following these steps 1 Create a Start Condition if possible 2 Clock nine cycles 3 Create another Start Condition followed by Stop Condition as shown below The device should be ready for the next communication after above steps have been completed In the event that t...

Страница 8: ... Cycle Timing SCL Serial Clock SDA Serial Data I O Note 1 The write cycle time tWR is the time from a valid Stop Condition of a Write sequence to the end of the internal clear write cycle SCL SDA IN SDA OUT tF tHIGH tLOW tLOW tR tAA tDH tBUF tSU STO tSU DAT tHD DAT tHD STA tSU STA tWR 1 Stop Condition Start Condition WORDn ACK 8th bit SCL SDA ...

Страница 9: ...receipt of this address the EEPROM will again respond with a zero and then clock in the first 8 bit data word Following receipt of the 8 bit data word the EEPROM will output a zero and the addressing device such as a microcontroller must terminate the Write sequence with a Stop Condition At this time the EEPROM enters an internally timed write cycle tWR to the nonvolatile memory All inputs are dis...

Страница 10: ...ted in the same way as Write operations with the exception that the Read Write select bit in the device address word is set to one There are three read operations Current Address Read Random Address Read Sequential Read Current Address Read The internal data word address counter maintains the last address accessed during the last Read or Write operation incremented by one This address stays valid ...

Страница 11: ...ntial Reads are initiated by either a Current Address Read or a Random Address Read After the microcontroller receives a data word it responds with an Acknowledge As long as the EEPROM receives an Acknowledge it will continue to increment the data word address and serially clock out sequential data words When the memory address limit is reached the data word address will roll over and the Sequenti...

Страница 12: ...ulk Tubes T Tape and Reel Standard Quantity Option E Tape and Reel Expanded Quantity Option M 1 7V to 5 5V Package Device Grade or Wafer Die Thickness H Green NiPdAu Lead Finish Industrial Temperature Range 40 C to 85 C U Green Matte Sn Lead Finish Industrial Temperature Range 40 C to 85 C 11 11mil Wafer Thickness Package Option P PDIP SS JEDEC SOIC X TSSOP MA UDFN ME XDFN ST SOT23 C VFBGA WWU Waf...

Страница 13: ...6C Truncation Code 16C AC Date Codes Voltages Y Year M Month WW Work Week of Assembly Minimum Voltage 6 2016 0 2020 A January 02 Week 2 M 1 7V min 7 2017 1 2021 B February 04 Week 4 8 2018 2 2022 9 2019 3 2023 L December 52 Week 52 Country of Assembly Lot Number Grade Lead Finish Material Country of Assembly AAA A Atmel Wafer Lot Number H Industrial NiPdAu U Industrial Matte Tin SnAgCu Trace Code ...

Страница 14: ...n Lead free Halogen free 8P3 Bulk Tubes 50 per Tube AT24C16C STUM T 5TS1 Tape and Reel 5 000 per Reel AT24C16C CUM T SnAgCu Lead free Halogen free 8U3 1 Tape and Reel 5 000 per Reel AT24C16C MEHM T N A 8ME1 Tape and Reel 5 000 per Reel AT24C16C WWU11M 1 N A Wafer Sale Note 1 Package Type 8P3 8 lead 0 300 wide Plastic Dual Inline Package PDIP 8S1 8 lead 0 150 wide Plastic Gull Wing Small Outline JE...

Страница 15: ... datum 5 Pointed or rounded lead tips are preferred to ease insertion 6 b2 and b3 maximum dimensions do not include Dambar protrusions Dambar protrusions shall not exceed 0 010 0 25 mm COMMON DIMENSIONS Unit of Measure mm SYMBOL MIN NOM MAX NOTE D D1 E E1 e L b2 b A2 A 1 N eA c b3 4 PLCS A 5 334 2 A1 0 381 A2 2 921 3 302 4 953 b 0 356 0 457 0 559 5 b2 1 143 1 524 1 778 6 b3 0 762 0 991 1 143 6 c 0...

Страница 16: ...0 51 C 0 17 0 25 D 4 80 5 05 E1 3 81 3 99 E 5 79 6 20 e 1 27 BSC L 0 40 1 27 Ø Ø 0 8 Ø E 1 N TOP VIEW C E1 END VIEW A b L A1 e D SIDE VIEW Package Drawing Contact packagedrawings atmel com 8S1 G 6 22 11 Notes This drawing is for general information only Refer to JEDEC Drawing MS 012 Variation AA for proper dimensions tolerances datums etc 8S1 8 lead 0 150 Wide Body Plastic Gull Wing Small Outline ...

Страница 17: ...c 2 Dimension D does not include mold Flash protrusions or gate burrs Mold Flash protrusions and gate burrs shall not exceed 0 15mm 0 006in per side 3 Dimension E1 does not include inter lead Flash or protrusions Inter lead Flash and protrusions shall not exceed 0 25mm 0 010in per side 4 Dimension b does not include Dambar protrusion Allowable Dambar protrusion shall be 0 08mm total in excess of t...

Страница 18: ...0 20 TOP VIEW SIDE VIEW BOTTOM VIEW Package Drawing Contact packagedrawings atmel com C E Pin 1 ID D 8 7 6 5 1 2 3 4 A A1 A2 D2 E2 e 6x L 8x b 8x Pin 1 ID K 1 2 3 4 8 7 6 5 Notes 1 This drawing is for general information only Refer to Drawing MO 229 for proper dimensions tolerances datums etc 2 The Pin 1 ID is a laser marked feature on Top View 3 Dimensions b applies to metallized terminal and is ...

Страница 19: ...G NO REV TITLE COMMON DIMENSIONS Unit of Measure mm DTP SYMBOL MIN NOM MAX NOTE 0 00 1 70 2 10 0 15 0 26 A A1 D E b e e1 L 1 80 2 20 0 20 0 40 TYP 1 20 REF 0 30 0 40 0 05 1 90 2 30 0 25 0 35 End View 8ME1 B 9 10 2012 8ME1 8 pad 1 80mm x 2 20mm body Extra Thin DFN XDFN Top View 6 5 7 4 3 E D 8 1 2 PIN 1 ID 0 10 0 15 b L b e PIN 1 ID e1 A1 A Side View ...

Страница 20: ... exceed 0 15 mm per side 2 The package top may be smaller than the package bottom Dimensions D and E1 are determined at the outermost extremes of the plastic body exclusive of mold flash tie bar burrs gate burrs and interlead flash but including any mismatch between the top and bottom of the plastic body 3 These dimensions apply to the flat section of the lead between 0 08 mm and 0 15 mm from the ...

Страница 21: ...ON DIMENSIONS Unit of Measure mm SYMBOL MIN NOM MAX NOTE A 0 73 0 79 0 85 A1 0 09 0 14 0 19 A2 0 40 0 45 0 50 b 0 20 0 25 0 30 2 D 1 50 BSC E 2 0 BSC e 0 50 BSC e1 0 25 REF d 1 00 BSC d1 0 25 REF 1 This drawing is for general information only 2 Dimension b is measured at maximum solder ball diameter 3 Solder ball composition shall be 95 5Sn 4 0Ag 5Cu Notes A2 SIDE VIEW A PIN 1 BALL PAD CORNER TOP ...

Страница 22: ...d backside mark YMXX to front side line2 Added Country of Assembly 8719C 01 2015 Add the UDFN Expanded Quantity Option Update the 8X 8MA2 8P3 and 8U3 1 package outline drawings the ordering information section and the disclaimer page 8719B 07 2013 Minor grammatical corrections Update Atmel logos and template 8719A 09 2010 Initial document release ...

Страница 23: ...E THIS DOCUMENT EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and products descriptions at any time without notice Atmel does not make any commitment to update the information contained herein Unless ...

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