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Package Information
© 2008 Advanced Micro Devices, Inc.
41978 AMD RS690M Databook 3.06
Proprietary
5-9
5.3.3
Board Solder Reflow Process Recommendations
5.3.3.1
Stencil Opening Size for Solderball Pads on PCB
It is recommended that the stencil aperture for solderballs be kept at the same size as the land pads' except for the
nine pads at each corner of the ASIC package, for which a maximum size of 400µm is recommended (see
below). This recommendation is based on AMD’s sample land pattern design for the RS690M, which is
available from your AMD CSS representative.
Figure 5-5 Stencil Opening Recommendations
5.3.3.2
Reflow Profile
A reference reflow profile is given below. Please note the following when using RoHS/lead-free solder (SAC105/305/405
Tin-Silver-Cu):
•
The final reflow temperature profile will depend on the type of solder paste and chemistry of flux used in the SMT
process. Modifications to the reference reflow profile may be required in order to accommodate the requirements of
the other components in the application.
Stencil apperture
for solderballs to
be kept at the same
size as the land
pads', except for
the corner balls.
400
µ
m maximum for
the nine corner balls'
openings
400
µ
m maximum for
the nine corner balls'
openings
400
µ
m maximum for
the nine corner balls'
openings
400
µ
m maximum for
the nine corner balls'
openings
Содержание RS690M
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