MIX-Q670A1
1-2
1.3
Specifications
SYSTEM
Form factor
Mini ITX Form Factor, 6.7” x 6.7” (170 mm x 170 mm)
CPU
Intel
®
Alder Lake – S (ADL-S) Processors 8+8 cores, 65W & Intel
®
Raptor Lake – S (RPL-S) Processors, RPL-S 8+16 cores, 65W
Memory
2 x SODIMM, DDR5 (4800MHz, Max. 64GB) memory
Dual-channel memory architecture
I/O Chipset
NCT6126D
Ethernet
1 x Intel
®
PCIe Gb LAN i219LM for vPro
1 x Intel
®
PCIe Gb LAN i210AT
BIOS
256Mbit Flash ROM, AMI BIOS
Wake on LAN/PXE
Yes (WOL/PXE)
Watchdog Timer
1~255 steps by software program
H/W Monitor
Temperature Monitor on CPU/System
Voltage Monitor on Vcore/5V/3.3V/12V
Fan Monitor on CPU/Chassis
Smart Fan Control
CPU Fan/Chassis Fan
Power State
S3, S4, S5
Expansion slot
1 x PCIe [x16] slot (Gen 5.0)
1 x M.2 (3042/3052; default: 3052) B-key (PCIex1 / NVMe; Gen3)
TPM
Infineon SLB9670 TPM2.0 onboard
Battery
Lithium battery
Power requirement
ATX
Board size
6.7” x 6.7” (170 mm x 170 mm)
Weight
1.1 lb (0.5 Kg)
Operating
temperature
32°F~131°F (0°C~60°C)
Storage temperature
-40°F ~185°F (-40°C ~85°C)
Operating humidity
0%~90% relative humidity, non-condensing
Power compliance
N/A
Certificate
CE/FCC Class A
GRAPHICS
Graphics chipset
Intel
®
UHD Graphics
Graphics
mutlti-display
Quad independent display
HDMI™
HDMI™
2.0; Up to 4096 x 2160 @ 60 Hz / 2560 x 1600 @ 60 Hz,
with Digital Audio
DisplayPort
Up to 4096 x 2160 @ 60 Hz
LVDS
Up to 1920 x 1080 @60 Hz, Daul Channel 18/24 bit
co-layout with eDP
eDP
Up to 1920 x 1080 @ 60 Hz
co-layout with LVDS
Backlight control
PWM
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Содержание MIX-Q670A1
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Страница 18: ...MIX Q670A1 2 10 To uninstall the CPU heatsink and fan assembly 1 A B A B ...
Страница 20: ...MIX Q670A1 2 12 To remove a DIMM 2 5 1 Installing a DIMM 1 2 A B ...
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