HDSL T200 HTU-R, Span Powered, 60 mA Installation and Maintenance Practice
4
61247026L1-5A
CAUTION
Per GR-1089-CORE the HDSL System is designed and intended for
installation as part of a Common Bonding Network (CBN). The
HDSL System is not designed nor intended for installation as part
of an Isolated Bonding Network (IBN).
CAUTION
Per GR-1089-CORE Section 9, the T200 HTU-R, SP/60 mA does
not have an internal DC connection between –48VR and frame
ground. As such, it may be installed in a DC-I (isolated) or DC-C
(common) installation. For installations where other cards or the
host system have internal connections between –48 VR and frame
ground, the system would be intended for deployment only in a
DC-C installation.
NOTE
The HDSL port is classified as Type 3 and 5, as defined in Appendix
B of GR-1089-CORE Issue 4, and meets the lightning and power
fault criteria with any primary protector that meets any of the
voltage limits of GR-974-CORE or GR-1361-CORE (i.e., carbon
blocks, gas tubes, solid states, etc.).
NOTE
The DS1 port is classified as Type 3, 4, and 5, as defined in
Appendix B of GR-1089-CORE Issue 4, and meets the lightning
and power fault criteria of GR-1089-CORE Issue 4 with primary
protectors that meet any of the voltage limits of GR-974-CORE or
GR-1361-CORE (i.e., carbon blocks, gas tubes, solid states, etc.). If
the DS1 is deployed as Type 4, primary protectors are not required.
NOTE
Current limiting protectors are not required.
