All devices are grounded through the DIN rail to chassis ground. Use zinc
plated yellow-chromate steel DIN rail to assure proper grounding. The use of
other DIN rail materials (e.g. aluminium, plastic, etc.) that can corrode, oxidize,
or are poor conductors, can result in improper or intermittent grounding.
5.3.1 Optimized mounting of the option boards
The AC500-eCo processor modules have up to 3 slots for option boards.
The best thermal circulation is given on slot 3 (bottom slot), followed by slot 2 (middle slot) and
then slot 1 (top slot).
The best mounting position of the option board depends on its power dissipation.
Rules for optimized mounting of the option boards
–
The greater the power dissipation of the option board, the lower the
mounting position should be selected.
–
The TA5126-2AO-UI option board has the highest power dissipation
and must always be mounted at the lowest option board slot.
The optimized mounting position can be easily determined with the help of this
table.
Table 4: Power dissipation of the option boards
Power dissipation of
the option boards
Digital
Analog
Serial interface
Accessory
very small
TA5141-RS232I(W)
TA5142-RS485I(W)
TA5142-RS485(W)
TA5130-KNXPB(W)
TA5131-RTC
small
TA5105-4DOT(W)
TA5123-2AI-RT(D/W)
medium
TA5110-2DI2DO(T/W)
TA5101-4DI(W)
TA5120-2AI-UI(W)
large
TA5126-2AO-UI(W)
If the option boards to be mounted are in the same power dissipation level, then
the slots can be freely selected.
Mechanical planning and installation
Mounting and demounting - general information > Optimized mounting of the option boards
2023/03/03
3ADR011074, 1, en_US
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