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Document #800-0351-001 Rev B
Page 18
ZS COMP INSTALLATION MANUAL FOR COMPOSITION SHINGLE ROOFS - U.S.
4.3 Grounding/Earthing
The Zep Compatible design concept allows the installer to build a hyper-bonded array with a single
ground bond connection. In a hyper-bonded array, every module is structurally and electrically
bonded to the surrounding modules, on all sides. This eliminates the need for extensive lengths of
copper wire run to every module in order to ground the array.
In some situations, portions of the array may require additional ground bond connections. The
illustrations on the following pages show when additional Equipment Grounding Conductors or
jumpers are required.
4.3.1 Grounding Path Examples
The following examples show how a Zep Compatible PV array is hyper-bonded using Interlocks.
Figure 4.5 Grounding Path - Simple Array
Figure 4.6 Grounding Path - Hybrid Interlocks or Thermal Expansion Joints
Interlock
Ground Zep
Equipment Grounding
Conductor (EGC)
Bond path
Interlock
Hybrid Interlock or
Thermal Expansion
Joint
Ground Zep
Equipment Grounding
Conductor (EGC)
Bond path
An array with a continuous column of Hybrid Interlocks (or a Thermal Expansion Joint) must be
installed with a Ground Zep on either side of the column and a copper conductor wire between
the two, in order to bond the two electrically isolated sub-array sections.
