ZBA Inc
.
ZBA, Inc.
94 Old Camplain Road Hillsborough, NJ 08844
Ph: 908-359-2070 Fax: 908-595-0909
Web: http://www.zbausa.com/
Solder Profile
NOTE:
Contact ZBA if you wish
to reflow the Modules in your production environment
. There are
specific configurations that need to be reviewed with the production facility to allow for proper reflow of
the modules.
SAMPLE QUANTITIES OR SMALL PRODUCTION RUNS WILL TYPICALLY BE
CONFIGURED FOR HAND SOLDERING.
The soldering profile depends on various parameters necessitating a set up for each application. The data
here is given only for guidance on solder re-flow. There are four zones:
1.
Preheat Zone - This zone raises the temperature at a controlled rate, typically 1-2.5°C/s.
2.
Equilibrium Zone - This zone brings the board to a uniform temperature and also activates the
flux.
3.
The duration in this zone (typically 2 -3 minutes) will need to be adjusted to optimize the out
gassing of the flux.
4.
Reflow Zone - The peak temperature should be high enough to achieve good wetting but not so
high as to cause component discoloration or damage. Excessive soldering time can lead to inter-
metallic growth which can result in a brittle joint.
5.
Cooling Zone - The cooling rate should be fast, to keep the solder grains small which will give a
longer lasting joint. Typical rates will be 2-5°C/s.
Solder Re-Flow Profile
Figure 11-3 Typical Lead-Free Re-flow Solder Profile
12
Ordering Information
