Z3 Technology HE4K-DCK-10, Hardware Specification

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10
HE4K-DCK-10
HARDWARE SPECIFICATION
CONFIDENTIAL DOC-USR-0100-01
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Z3 Technology, LLC ♦ 100 N. 8th St. STE 250 ♦ Lincoln, NE 68508-1369 USA ♦ +1.402.323.0702
THERMAL CONSIDERATIONS 4.0
The HE4K-DCK-10 encoder consumes only about 4W at maximum power operation. The Sony FCB-ER8300
block camera consumes about 3.5W, so the total power dissipation of the system is 7.5W typically.
While a 7.5W power budget is very good, it is still enough power to cause overheating unless proper heat
dissipation methods are employed.
The user is responsible for ensuring that the complete system has enough heat dissipation to ensure
proper operating temperature of all components at all times.
The table below lists the most critical components from the thermal point of view, along with the maximum
junction temperature as specified by the vendor datasheet.
Chip Location Max Tj Notes
CPU U3, Main Encoder PCB 105 °C
The chip spec is not very clear, and lists
some contradicting values, such as max TJ
of 125 °C and max ambient temperature of
70 °C.
FPGA U7, Front End PCB 85 °C
Xilinx specifies a θ
JC
of 10.6 °C/W for this
package (CSG225).
HDMI FE U1, Front End PCB 125 °C
ADI specifies a max 70 °C ambient
temperature.
Table 1 Temperature Critical Components
When designing the thermal dissipation for the HE4K-DCK-10 it is important to consider the thermal behavior
of
all parts of the system, including the PCBs, enclosure, camera block, etc.
While the majority of the power dissipation comes from the components listed in the table above, other
parts such as the DDR chip, power IC’s and inductors also contribute some power to the system and cause
the PCB to heat up. The heated-up PCB in turn will raise the ambient temperature of the entire system.
When incorporating the HE4K-DCK-10 boards into a final application, the systems engineer must ensure
proper thermal management. Failure to remove heat from the CPU may cause permanent damage to the
CPU and encoder and loss of warranty coverage.