xFusion Digital Technologies FusionServer CH242 V5 Manual Download

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FusionServer CH242 V5 Compute Node
Technical White Paper

B Glossary

2022-08-12

B.5 U-Z

A unit defined in International Electrotechnical Commission
(IEC) 60297-1 to measure the height of a cabinet or chassis. 1
U = 44.45 mm

UltraPath
Interconnect (UPI)

A point-to-point processor interconnect developed by Intel.

Summary of Contents for FusionServer CH242 V5

Page 1: ...FusionServer CH242 V5 Compute Node Technical White Paper Issue 04 Date 2022 08 12 xFusion Digital Technologies Co Ltd ...

Page 2: ...t bear any liability resulting from the use of xFusion The purchased products services and features are stipulated by the contract made between xFusion and the customer All or part of the products services and features described in this document may not be within the purchase scope or the usage scope Unless otherwise specified in the contract all statements information and recommendations in this ...

Page 3: ...n Positions 16 5 2 Processor 16 5 3 Memory 17 5 3 1 DDR4 Memory 17 5 3 1 1 Memory Identifier 17 5 3 1 2 Memory Subsystem Architecture 18 5 3 1 3 Memory Compatibility 20 5 3 1 4 DIMM Installation Rules 22 5 3 1 5 Memory Installation Positions 23 5 3 1 6 Memory Protection Technologies 25 5 4 Storage 26 5 4 1 Drive Configurations 26 5 4 2 Drive Numbering 26 5 4 3 Drive Indicators 27 5 4 4 RAID Contro...

Page 4: ...ns 35 6 1 Technical Specifications 35 6 2 Environmental Specifications 37 6 3 Physical Specifications 39 7 Software and Hardware Compatibility 40 8 Safety Instructions 41 8 1 Security 41 8 2 Maintenance and Warranty 44 9 System Management 45 10 Certifications 47 A Appendix 49 B Glossary 53 C Acronyms and Abbreviations 56 ...

Page 5: ...vel of risk which if not avoided will result in death or serious injury Indicates a hazard with a medium level of risk which if not avoided could result in death or serious injury Indicates a hazard with a low level of risk which if not avoided could result in minor or moderate injury Indicates a potentially hazardous situation which if not avoided could result in equipment damage data loss perfor...

Page 6: ... 3 Physical Specifications Added A 1 Node Label 03 2022 06 25 Added a figure that shows how to measure dimensions Updated 6 1 Technical Specifications and claimed support for U 2 drives Upgrades the standards of CE and UKCA certifications in the chapter 10 Certifications 02 2022 03 18 Added10 Certifications 01 2021 12 20 This issue is the first official release ...

Page 7: ...que blend of supreme computing power large memory and high flexibility and expandability The CH242 V5 provides dense computing capability and an ultra large memory It is optimized for virtualization cloud computing high performance computing and compute intensive enterprise applications The CH242 V5 compute nodes are installed in an E9000 chassis and are centrally managed by the management module ...

Page 8: ...nificantly accelerates floating point performance for computing intensive applications The Cascade Lake processors support Intel Deep Learning Boost vector neural network instructions VNNI to improve the performance of deep learning applications The CH242 V5 fully configured with 48 LRDIMMs provides supreme speed high availability and a maximum memory capacity of 6 TB The maximum theoretical memor...

Page 9: ...thm allows faster and stronger encryption Intel Execute Disable Bit EDB function prevents certain types of malicious buffer overflow attacks when working with a supported OS Intel Trusted Execution Technology enhances security using hardware based defense against malicious software attacks allowing applications to run independently The trusted platform module TPM 2 0 provides advanced encryption f...

Page 10: ...gure 3 1 CH242 V5 physical structure 1 Optional HHHL PCIe riser module 2 Optional HHHL PCIe card 3 Optional M 2 SSD 4 Optional USB flash drive 5 Optional TPM 6 RAID controller card 7 Optional Supercapacitor 8 Heat sink 9 Optional M 2 FRUb 10 Optional M 2 adapterb 11 Drivea 12 Drive cage 13 BIOS battery 14 Processor ...

Page 11: ...cal Structure 2022 08 12 11 15 Mezzanine card 16 Mainboard 17 Memory a The drive slots support 2 5 inch SAS SATA NVMe drives and M 2 modules and mixed configuration of them b An M 2 module is a 2 5 inch drive module that consists of one M 2 adapter and two M 2 FRUs ...

Page 12: ...each other through three UPI links at a speed of up to 10 4 GT s The mezzanine cards connect to the processors through PCIe buses to provide service ports The Platform Controller Hub PCH has a built in MAC chip and provides two 10 Gbit s ports The storage module consisting of a RAID controller card and a drive backplane connects to the CPUs through PCIe buses The iBMC provides device management fu...

Page 13: ...iption 5 1 Front Panel 5 2 Processor 5 3 Memory 5 4 Storage 5 5 Network 5 6 I O Expansion 5 7 Boards 5 1 Front Panel 5 1 1 Appearance Figure 5 1 Front view 1 Slide out label plate with an SN label 2 Ejector levers 3 Ejector release buttons 4 2 5 drivesa 5 Model 6 M 2 FRU 7 M 2 adapter 8 M 2 moduleb 9 PCIe panel ...

Page 14: ...on Descriptions Table 5 1 Description of indicators and buttons on the front panel Sign Indicator and Button Description Power button indicator Power indicator Off The device is not powered on Steady green The device is powered on Blinking yellow The iBMC is starting The power button is locked and cannot be pressed The iBMC is started in about 1 minute and then the power indicator is steady yellow...

Page 15: ...utton description You can control the UID indicator status by pressing the UID button or by using the iBMC or MM910 You can press this button to turn on or off the UID indicator You can press and hold down this button for 4 to 6 seconds to reset the iBMC HLY Health status indicator Off The device is powered off or is faulty Blinking red at 1 Hz A major alarm has been generated for the device Blink...

Page 16: ...s properly The server may operate abnormally if an abnormal USB device is connected 5 1 4 Installation Positions The CH242 V5 is installed in a full width slot in the front of the E9000 chassis An E9000 chassis can house a maximum of eight CH242 V5 compute nodes Figure 5 4 Installation positions 5 2 Processor The server supports two or four processors If two processors are required install them in...

Page 17: ... Contact your local sales representative or use the Compatibility Checker to determine the components to be used Figure 5 5 Processor positions 5 3 Memory 5 3 1 DDR4 Memory 5 3 1 1 Memory Identifier You can determine the memory module properties based on the label attached to the memory module ...

Page 18: ...anks of the memory module 1R single rank 2R dual rank 4R quad rank 8R octal rank 3 Data width on the DRAM X4 4 bit X8 8 bit 4 Type of the memory interface PC3 DDR3 PC4 DDR4 5 Maximum memory speed 2133 MT S 2400 MT S 2666 MT S 2933 MT S 6 Column Access Strobe CAS latency P 15 T 17 7 DIMM type R RDIMM L LRDIMM 5 3 1 2 Memory Subsystem Architecture The CH242 V5 provides 48 memory slots Each processor...

Page 19: ...MM000 1A1 1A DIMM001 1A2 1B primary DIMM010 1B1 1B DIMM011 1B2 1C primary DIMM020 1C1 1C DIMM021 1C2 1D primary DIMM030 1D1 1D DIMM031 1D2 1E primary DIMM040 1E1 1E DIMM041 1E2 1F primary DIMM050 1F1 1F DIMM051 1F2 CPU 2 2A primary DIMM100 2A1 2A DIMM101 2A2 2B primary DIMM110 2B1 2B DIMM111 2B2 2C primary DIMM120 2C1 2C DIMM121 2C2 2D primary DIMM130 2D1 2D DIMM131 2D2 2E primary DIMM140 2E1 2E D...

Page 20: ...E1 3E channel DIMM241 3E2 3F primary DIMM250 3F1 3F channel DIMM251 3F2 CPU 4 4A primary DIMM300 4A1 4A channel DIMM301 4A2 4B primary DIMM310 4B1 4B channel DIMM311 4B2 4C primary DIMM320 4C1 4C DIMM321 4C2 4D primary DIMM330 4D1 4D DIMM331 4D2 4E primary DIMM340 4E1 4E channel DIMM341 4E2 4F primary DIMM350 4F1 4F channel DIMM351 4F2 5 3 1 3 Memory Compatibility Observe the following rules when ...

Page 21: ...s The total memory capacity cannot exceed the maximum memory capacity supported by the CPUs Use the Compatibility Checker to determine the capacity type of a single memory module The maximum number of DIMMs supported by a server varies depending on the CPU type memory type rank quantity and operating voltage Each memory channel supports a maximum of 8 ranks The number of DIMMs supported by each ch...

Page 22: ...8 48 48 48 Maximum DDR4 memory capacity of the node GB b 768 1536 3072 6144 Maximum operating speed MT s 1DPCc 2933d 2933d 2666 2666 2DPC 2666 2666 2666 2666 a The maximum number of DDR4 memory modules is based on four processor configuration The value is halved for a server with two processors b The maximum DDR4 memory capacity varies depending on the processor type The value listed in this table...

Page 23: ...ply with the general installation guidelines Each processor supports two integrated memory controllers IMCs At least two channels of each IMC are used for installing memory modules channels 1 and 2 or channels 1 2 and 3 The installed memory modules must be identical in size and organization For a multi processor configuration each processor must have a valid memory mirroring configuration Memory s...

Page 24: ...FusionServer CH242 V5 Compute Node Technical White Paper 5 Hardware Description 2022 08 12 24 Figure 5 7 Memory slots Figure 5 8 DDR4 memory installation guidelines 2 processors ...

Page 25: ...otection Technologies The following memory protection technologies are supported ECC Full mirroring Address range mirroring SDDC SDDC 1 Rank sparing mode Static virtual lockstep Faulty DIMM isolation Memory thermal throttling Memory address parity protection Memory demand patrol scrubbing Device tagging Data scrambling Adaptive double device data correction ADDDC ADDDC 1 ...

Page 26: ... be installed only in slots 0 to 7 1 x RAID controller card Screw in RAID controller card installed in the RAID controller card connector on the mainboard a Only 2 5 inch drives fit into the front slots b Mixed configuration of M 2 modules and SAS SATA NVMe drives is supported Contact your local sales representative or use the Compatibility Checker to determine the components to be used 5 4 2 Driv...

Page 27: ...llow Description Off Off The drive is not in position Steady on Off The drive is detected Blinking at 4 Hz Off Data is being read or written normally or data on the primary drive is being rebuilt Steady on Blinking at 1 Hz The drive is being located Blinking at 1 Hz Blinking at 1 Hz Data on the secondary drive is being rebuilt Off Steady on A member drive in the RAID array is removed Steady on Ste...

Page 28: ...synchronized Steady green The M 2 FRU is inactive NVMe Drive Indicators Figure 5 14 NVMe drive indicators If the VMD function is enabled and the latest VMD driver is installed the NVMe drives support surprise hot swap Table 5 7 NVMe drive indicators VMD enabled Activity Indicator Green Fault Indicator Yellow Description Off Off The NVMe drive cannot be detected Steady on Off The NVMe drive is work...

Page 29: ...Me drive is removable Steady on Off Steady on The NVMe drive is faulty 5 4 4 RAID Controller Card The RAID controller card supports RAID configuration RAID level migration and drive roaming Contact your local sales representative or use the Compatibility Checker to determine the components to be used For details about the RAID controller card see V5 Server RAID Controller Card User Guide 5 5 Netwo...

Page 30: ...orcibly will make the WOL function of the LOM ports invalid If flow control is enabled for a LOM port the switch module connected to the LOM port must also have flow control enabled Table 5 9 I O modules supported by the LOM I O Module I O Module Slot LOM Remarks CX916 2X 3X 1E 4E The LOM cannot communicate with the I O modules in slots 1E and 4E CX916L 2X 3X 1E 4E The LOM cannot communicate with ...

Page 31: ...socket are unavailable Table 5 10 PCIe slot description PCIe Slot Name on iBMC CPU PCIe Stand ards Conne ctor Width Bus Width Port No Ro ot Por t B D F De vic e B D F Slot Size RAID control ler card CPU 1 PCIe 3 0 x8 x8 Port1A 08 00 0 09 0 0 0 LOM CPU 1 PCIe 3 0 x8 x8 Port1C 08 02 0 0c 0 0 00 Mezz 1 CPU 1 PCIe 3 0 x16 or two x8 x16 or two x8 Port2A 24 00 0 24 02 0 25 0 0 0 26 0 0 0 Mezz 2 CPU 2 PC...

Page 32: ...0 2 5 drive PCIe SSD 2 disk2 CPU 4 PCIe 3 0 x4 x4 Port3B f1 01 00 f3 0 0 0 2 5 drive PCIe SSD 4 disk4 CPU 4 PCIe 3 0 x4 x4 Port3C f1 02 00 f4 0 0 0 2 5 drive PCIe SSD 6 disk6 CPU 4 PCIe 3 0 x4 x4 Port3D f1 02 00 f5 0 0 0 2 5 drive The B D F Bus Device Function Number values are the default values when the server is fully configured with PCIe devices The values may vary if the server is not fully c...

Page 33: ...connector 5 Mezzanine card 2 connector 6 Mezzanine card brackets 7 Positioning sleeve 8 Backplane signal connector 9 Power connector 10 Mezzanine card 4 connector 11 Mezzanine card 3 connector 12 Drive cage 13 RAID controller card connectors 14 PCIe riser card connector 15 Jumper J76 b 16 RTC battery 17 CPU3 OPA sideband signal port 18 TPM connector 19 HLY indicator 20 UID button indicator 21 Powe...

Page 34: ...FusionServer CH242 V5 Compute Node Technical White Paper 5 Hardware Description 2022 08 12 34 b The CLR_BMC_PW pin is used to restore the iBMC to default configuration ...

Page 35: ... processors Intel Xeon Scalable Skylake and Cascade Lake processors Built in memory controller and six memory channels Built in PCIe controller supporting PCIe 3 0 and 48 lanes per processor Three UPI buses between processors providing up to 10 4GT s transmission per channel Up to 28 cores per processor Max 3 8 GHz Min 1 375 MB L3 cache per core Max 205 W TDP NOTE The preceding information is for ...

Page 36: ... not occupy a standard PCIe slot For details about the RAID controller card see V5 Server RAID Controller Card User Guide NOTE If the BIOS is in legacy mode 4Kn drives 4 KB sectors in physical and logical layers are not supported Network Supports LOM Supports two 10GE Ethernet ports to connect to the Base network ports on the switch modules in slots 2X and 3X The LOM ports support WOL and PXE NOTE...

Page 37: ...ts Ports on the front panel Two USB 3 0 ports Built in port One USB 3 0 port NOTE The maximum dimensions H x W x D of the built in USB device are 33 9 mm x 14 5 mm x 7 12 mm 1 33 in x 0 57 in x 0 28 in Video card An SM750 video chip with 32 MB display memory is integrated on the mainboard The maximum display resolution is 1600 x 1200 at 60 Hz with 16 M colors System management Supports UEFI Suppor...

Page 38: ...guration complies with ASHRAE Class A3 standards and the altitude is above 900 m 2952 76 ft the highest operating temperature decreases by 1 C 1 8 F for every increase of 175 m 574 14 ft HDDs cannot be used at an altitude of over 3050 m 10006 44 ft Corrosive gaseous contaminant Maximum corrosion product thickness growth rate Copper corrosion rate test 300 Å month meeting level G1 requirements of t...

Page 39: ...ils see the manuals provided by drive vendors 6 3 Physical Specifications Table 6 3 Physical specifications Item Description Dimensions H x W x D 60 46 mm x 423 mm x 537 2 mm 2 38 in x 16 65 in x 21 15 in Figure 6 1 Physical dimensions NOTE See Figure 6 1 for methods in measuring physical dimensions of the server node Fully equipped weight Net weight 16 kg to 17 kg 35 27 lb to 37 48 lb Packing mat...

Page 40: ...basic middleware software and hardware The slight differences of the application software middleware basic software and hardware may cause performance inconsistency between the application layer and test software layer If the customer has requirements on the performance of specific application software contact sales personnel to apply for POC tests in the pre sales phase to determine detailed soft...

Page 41: ...lowed to perform special tasks such as performing high voltage operations and driving a forklift If this device works in a residential environment the wireless interference may be generated Human Safety Only certified or authorized personnel are allowed to install the device Discontinue any dangerous operations and take protective measures Report anything that could cause personal injury or device...

Page 42: ...s watches and jewelry Figure 8 2 shows conductive objects that must be removed before you touch a device Figure 8 2 Removing conductive objects Figure 8 3 shows how to wear an ESD wrist strap a Put your hands into the ESD wrist strap b Tighten the strap buckle and ensure that the ESD wrist strap is in contact with your skin c Insert the ground terminal attached to the ESD wrist strap into the jack...

Page 43: ...Equipment Safety Use the recommended power cables at all times Use power cables only for dedicated servers Do not use them for other devices Before operating equipment wear ESD clothes and gloves to prevent electrostatic sensitive devices from being damaged by ESD When moving a device hold the bottom of the device Do not hold the handles of the installed modules such as the PSUs fan modules drives...

Page 44: ... Carried by a Person To reduce the risk of personal injury comply with local regulations with regard to the maximum weight one person is permitted to carry Table 8 1 lists the maximum weight one person is permitted to carry as stipulated by a number of organizations Table 8 1 Maximum weight carried per person Organization Weight kg lb European Committee for Standardization CEN 25 55 13 Internation...

Page 45: ...ures and protocols KVM and text console redirection Remote virtual media IPMI SNMP Common information model CIM Redfish Browser based login Specifications Table 9 1 iBMC specifications Specifications Description Management interface Integrates with any standard management system through the following interfaces IPMI CLI HTTPS SNMP Redfish Fault Detection Detects and accurately locates faults in a ...

Page 46: ...lt reproduction Reproduces faults to facilitate fault diagnosis Screen snapshots and videos Allows users to view screenshots and videos without login facilitating routine preventive maintenance inspection PMI Black Box Allows users to enable or disable the black box function and download black box data DNS LDAP Supports domain management and directory services which significantly simplify network ...

Page 47: ...015 A11 2020 CISPR 32 2015 A1 2019 EN IEC 61000 3 2 2019 A1 2021 EN 61000 3 3 2013 A1 2019 EN 55035 2017 A11 2020 CISPR 35 2016 EN 55024 2010 A1 2015 CISPR 24 2010 A1 2015 ETSI EN 300 386 V1 6 1 2012 ETSI EN 300 386 V2 1 1 2016 RoHS EN IEC 63000 2018 ErP Commission Regulation EU 424 2019 UK UKCA Safety EN 62368 1 2014 A11 2017 EMC EN 55032 2015 A11 2020 CISPR 32 2015 A1 2019 EN IEC 61000 3 2 2019 ...

Page 48: ...cation Standards CISPR 35 2016 EN 55024 2010 A1 2015 CISPR 24 2010 A1 2015 ETSI EN 300 386 V1 6 1 2012 ETSI EN 300 386 V2 1 1 2016 RoHS BS EN IEC 63000 2018 ErP Commission Regulation EU 424 2019 US FCC FCC PART 15 Canada IC ICES 003 China RoHS SJ T 11364 GB T 26572 Japan VCCI VCCI 32 1 Global CB IEC 62368 1 2014 ...

Page 49: ... Figure A 1 Position of the CH242 V5 label Table A 1 CH242 V5 Label description No Description 1 Serial number of the server node For details see A 2 Product SN A 2 Product SN The serial number SN on the slide out label plate uniquely identifies a device The SN is required when you contact technical support ...

Page 50: ...s 2023 to 2032 respectively NOTE The years from 2010 are represented by upper case letters excluding I O and Z because the three letters are similar to the digits 1 0 and 2 The second character indicates the month Digits 1 to 9 indicate January to September respectively Letters A to C indicate October to December respectively 5 Serial number six digits 6 RoHS compliance one character Y indicates R...

Page 51: ...DDC Corrects single chip multi bit errors to improve memory reliability Device Tagging Degrades and rectifies memory faults to improve memory availability Data Scrambling Optimizes data flow distribution to reduce the error probability and improve memory data flow reliability and address error detection PCIe PCIe Advanced Error Reporting Provides a PCIe advanced error reporting mechanism to improv...

Page 52: ...y uncorrectable errors to improve system availability Enhanced Machine Check Architecture eMCA Gen2 Improves system availability OOB access to MCA registers The out of band system can access MCA registers through the PECI When a fatal error occurs in the system the out of band system can collect onsite data to facilitate subsequent fault analysis and locating and improve system serviceability BIOS...

Page 53: ...ith Intel and DEC Ethernet uses the Carrier Sense Multiple Access Collision Detection CSMA CD access method and allows data transfer over various cables at 10 Mbit s The Ethernet specification is the basis for the IEEE 802 3 standard B 2 F J G Gigabit Ethernet GE An extension and enhancement of traditional shared media Ethernet standards It is compatible with 10M and 100M Ethernet and complies wit...

Page 54: ...on system Intel is the main sponsor for PCIe PCIe is used only for internal interconnection A PCI system can be transformed to a PCIe one by modifying the physical layer instead of software PCIe delivers a faster speed and can replace almost all AGP and PCI buses R redundancy A mechanism that allows a backup device to automatically take over services from a faulty device to ensure uninterrupted ru...

Page 55: ...er B Glossary 2022 08 12 55 B 5 U Z U U A unit defined in International Electrotechnical Commission IEC 60297 1 to measure the height of a cabinet or chassis 1 U 44 45 mm UltraPath Interconnect UPI A point to point processor interconnect developed by Intel ...

Page 56: ...lternating current AES Advanced Encryption Standard New Instruction Set ARP Address Resolution Protocol AVX Advanced Vector Extensions B BBU backup battery unit BIOS Basic Input Output System C CD calendar day CE Conformite Europeenne CIM Common Information Model CLI command line interface D DC direct current DCPMM DC persistent memory module ...

Page 57: ...access memory DVD digital video disc E ECC error checking and correcting ECMA European Computer Manufacturer Association EDB Execute Disable Bit EN European Efficiency ERP enterprise resource planning ETS European Telecommunication Standards C 2 F J F FB DIMM Fully Buffered DIMM FC Fiber Channel FCC Federal Communications Commission FCoE Fibre Channel over Ethernet FTP File Transfer Protocol G GE ...

Page 58: ...a ICMP Internet Control Message Protocol IDC Internet Data Center IEC International Electrotechnical Commission IEEE Institute of Electrical and Electronics Engineers IGMP Internet Group Message Protocol IOPS input output operations per second IP Internet Protocol IPC intelligent power capability IPMB Intelligent Platform Management Bus IPMI Intelligent Platform Management Interface C 3 K O K KVM ...

Page 59: ...SI Network Controller Sideband Interface C 4 P T P PCIe Peripheral Component Interconnect Express PDU power distribution unit PHY physical layer PMBUS power management bus POK power OK PWM pulse width modulation PXE Preboot Execution Environment Q QPI Quick Path Interconnect R RAID redundant array of independent disks RAS reliability availability and serviceability RDIMM registered dual in line me...

Page 60: ...gle device data correction SERDES serializer deserializer SGMII serial gigabit media independent interface SMI serial management interface SMTP Simple Mail Transfer Protocol SNMP Simple Network Management Protocol SOL serial over LAN SONCAP Standards Organization of Nigeria Conformity Assessment Program SSD solid state drive SSE Streaming SIMD Extensions T TACH tachometer signal TBT Turbo Boost Te...

Page 61: ...fered dual in line memory module UEFI Unified Extensible Firmware Interface UID unit identification light UL Underwriter Laboratories Inc USB Universal Serial Bus V VCCI Voluntary Control Council for Interference by Information Technology Equipment VGA Video Graphics Array VLAN virtual local area network VRD voltage regulator down W WEEE waste electrical and electronic equipment WSMAN Web Service ...

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