Use the largest available beaker (600 ml or 1000 ml)
for residual gold deposition. Please observe the maxi-
mum filling level.
If necessary, remove the hotplate cover and insert a
beaker containing the exhausted gold electrolyte and
20 ml brightener additive (do not exceed maximum
filling level!). Insert the appropriate agitator rod.
Pass two AGC
®
copper rods through the residual gold
sponge and cover it with shrink-fit plastic tubing.
In order to check the amount of residual gold you should
weigh the sponge before and after the residual gold is
deposited. The difference in weight gives you the weight
of the residual gold (a maximum of 20 – 25 g of gold
should be deposited onto a sponge). The gold electrolyte
may become discoloured during the heating-up phase.
Assemble the electroforming head and the silicone seal
and pull the copper rods through the two holes at the
front of the silicone seal (Nos. 5 + 6). Push the head
onto the mount, position the residual gold sponge (the
lower part of the sponge must not be below the anode!).
Push the head onto the beaker and connect the top
ends of the AGC
®
copper rods to the holder (see sketch).
Make sure that the sponge does not touch the anode!
The sponge has to be completely immersed, if neces-
sary add distilled water.
Use the timer button to set program 3.
Press the Start/Stop button to activate the process
(operating time: 120 min). The unit automatically
checks that the contacts are in order. In the event of a
faulty contact to the residual gold sponge, the error
code 001 will flash in the status display.
Rectify the faulty contact (e.g. copper rods not inserted
correctly into the sockets) and press the Start/Stop
button once more. The contact check is now repeated.
4
4.. R
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Note:
!
Note:
!
17
english
Summary of Contents for AGC Micro
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