CM52 Integrators’ Manual
WI_DEV_CM52_UGD_001-001
Page 16 of 53
CM52 Integrators’ Manual
2.2.2
Heat-Sink Requirements
The application is required to provide a heat-sink for the 3W AMPS capabilities of the CM52.
The application should be designed to provide a heat sink with a thermal resistance of 4.0
°
C/W.
For applications that disable the 3W mode (Class I) and only operate in 0.6W mode (Class III) a
heat-sink is not required.
2.2.3
Mounting Holes
Mounting holes and tabs are provided for proper mechanical support of the CM52 Wireless CPU
®
in
the customer’s application. The OEM’s application must provide sufficient mechanical retention
using the mounting holes and/or tabs or some other means. The system connector and RF
connector connections should not be used as a means of mechanical support. Also, please note
that the mounting holes may not substitute for the actual grounding pins provided via the system
connector.
Two mounting configurations are supported (A and B). Each has its own mechanical vibration
specification. Section 6 details the mechanical vibration specification for both configurations.
For machine screw mounting a wet torque of 8 in-lbs is recommended.
2.2.3.1
Mounting Configuration A
Mounting configuration “A” uses four exterior mounting holes that support #4 size screws.
Figure 7: Mounting Configuration A
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