16
Device Description
WAGO-I/O-SYSTEM 750
750-1504 16DO 24V DC 0.5A
s: 22 /Alle Serien (Allgemeine Module)/Überschriften für alle Serien/Anschlüsse - Überschrift 2 @ 4\mod_1240984262656_21.doc @ 31961 @ 2 @ 1
Po
3.2
Connectors
Po
s: 23 /Serie 750 (WAGO-I/O-SYSTEM)/Gerätebeschreibung/Anschlüsse/Datenkontakte/Klemmenbus - Überschrift 3 @ 6\mod_1256294684083_21.doc @ 43660 @ 3 @ 1
3.2.1
Data Contacts/Internal Bus
Po
s: 24.1 /Serie 750 (WAGO-I/O-SYSTEM)/Gerätebeschreibung/Anschlüsse/Datenkontakte @ 3\mod_1231771259187_21.doc @ 26002 @ @ 1
Communication between the coupler/controller and the bus modules as well as the
system supply of the bus modules is carried out via the internal bus. It is
comprised of 6 data contacts, which are available as self-cleaning gold spring
contacts.
Figure 2: Data contacts
Po
s: 24.2 /Serie 750 (WAGO-I/O-SYSTEM)/Wichtige Erläuterungen/Sicherheitshinweise/Achtung/Achtung: Busklemmen nicht auf Goldfederkontakte legen! @ 7\mod_1266318463636_21.doc @ 50695 @ @ 1
Do not place the I/O modules on the gold spring contacts!
Do not place the I/O modules on the gold spring contacts in order to avoid soiling
or scratching!
s: 24.3 /Serie 750 (WAGO-I/O-SYSTEM)/Wichtige Erläuterungen/Sicherheitshinweise/Achtung/Achtung: ESD - Auf gute Erdung der Umgebung achten! @ 7\mod_1266318538667_21.doc @ 50708 @ @ 1
Po
Ensure that the environment is well grounded!
The modules are equipped with electronic components that may be destroyed by
electrostatic discharge. When handling the modules, ensure that the environment
(persons, workplace and packing) is well grounded. Avoid touching conductive
components, e.g. data contacts.
s: 25 /Dokumentation allgemein/Gliederungselemente/---Seitenwechsel--- @ 3\mod_1221108045078_0.doc @ 21810 @ @ 1
Po
Manual
Version 1.0.1