TSSP57P38
www.vishay.com
Vishay Semiconductors
Rev. 2.2, 30-Mar-2021
7
Document Number: 82480
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
VISHAY LEAD (Pb)-FREE REFLOW SOLDER PROFILE
TAPING VERSION TSSP57P38 DIMENSIONS
in millimeters
max. 120 s
max. 100 s
max. 20 s
Max. ramp up 3 °C/s
max. 260 °C
10
100
1000
10000
0
50
100
250
300
0
300
Axis Title
2nd l
ine
Temperature (°C)
Time (s)
250
200
150
100
50
200
150
245 °C
217 °C
240 °C
255 °C
Max. ramp down 6 °C/s
Max. 2 cycles allowed
19800
Tape and reel dimen
s
ion
s
:
Part
s
mounted
Empty trailer 200 mm min.
Empty leader 400 mm min.
Direction of pulling out
Unreel direction
Ø 60 min.
Ø Y
2 ± 0.5
Label po
s
ted here
coming out from reel
Tape po
s
ition
(12.4)
18.4 max.
Ø 13 ± 0.2
Ø 21 ± 0.8
100 mm min. with cover tape
X 2:1
(2)
(1.75)
(5.5)
12 ± 0.3
(8)
(4)
(Ø 1.5)
(0.3)
(1.2)
Technical drawing
s
according to DIN
s
pecification
s
Not indicated tolerance
s
± 0.1
Drawing-No.: 9.700-5347.01-4
I
ss
ue: 2; 07.03.18
Reel
s
ize “Y”
TT1 Ø 180 ± 2 = 1800 pc
s
.
Leader and trailer tape:
