Design Guide & Applications Manual
For VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies
VI-200 and VI-J00 Family Design Guide
Rev 3.4
vicorpower.com
Page 54 of 97
Apps. Eng. 800 927.9474
800 735.6200
THERMAL DATA
Operating Ambient Temperature.
Depends on factors
such as output power, availability of forced air, and
mounting technique.
DO NOT
allow the ComPAC to
exceed its maximum operating temperature, which is
reached when the case is 85˚C. Temperature measured at
center of heat sink. (Full power can be delivered up to this
temperature.) Refer to Section 20,
Thermal Curves
, to
determine the maximum ambient temperature for your
application.
NOTE: To ensure proper heat transfer from the
internal module(s) to the heat sink, the mounting
holes through the heat sink must be properly
torqued at all times during operation. If the unit is
operated unmounted, insert a #6 or metric M3.5
flathead screw through each hole from below and
secure with a nut on top, torqued to 6 lb-in (0.83 N-m).
Thermal Impedance, Free Convection
.
Thermal resistance baseplate to air (˚C/W):
Forced Convection.
Thermal resistance baseplate to air
(horizontal mount):
NOTE: A 1.37" (34,8 mm) heat sink, option H1,
is also available.
17. DC Input Power System (ComPAC / MI-ComPAC Family)
Vertical
2.44
1.17
0.76
Horizontal
3.60
1.70
1.35
Type of
Mounting
1-Up
2-Up
3-Up
3.6
1.7
1.35
0
2.7
1.4
1.26
50
2.3
1.3
1.11
100
1.6
0.97
0.82
250
1.15
0.70
0.58
500
0.9
0.54
0.46
750
0.78
0.45
0.38
1,000
Thermal Resistance (°C / W)
Airflow (LFM)
1-Up
2-Up
3-Up
Summary of Contents for VI-200 Series
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