UM220-IV L User Manual
UC-00-M15 EN R1.4
Soldering and Disassembly
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6
Soldering and Disassembly
6.1
Disassembly
When it is necessary to remove the module, it is recommended to melt the soldering tin
of the pins on both sides of the module with an electric soldering iron and remove the
module with tweezers. Do NOT use other means to remove the module (for example, the
module is blown off by a hot air gun), which may lead to module damage.
6.2
Clean
Do NOT use alcohol or other organic solvents to clean, it may lead to flux residues into
the shielding shell, causing mildew and other problems
6.3
Reflow Soldering
In order to avoid component falling off, the module should be placed on the upper part
of the motherboard when soldering. The reflow temperature curve is recommended as
shown in figure 6-1 below (M705-GRN360 is recommended for solder paste).
Note: The module can only be soldered once.
Figure 6- 1 Reflow Soldering Curve
