TOBY-L2 and MPCI-L2 series - System Integration Manual
UBX-13004618 - R28
Design-in
Page 120 of 164
2.12
TOBY-L2 series module footprint and paste mask
describe the suggested footprint (i.e. copper mask) layout for TOBY-L2 series
modules. The proposed land pattern layout slightly reflects the modules’ pads layout, with most of
the lateral pads designed wider on the application board (1.8 x 0.8 mm) than on the module
(1.5 x 0.8 mm).
I1
A
G
H
J
D
F2
K
M1 M1
M2
P2
B
G
H
J
O
O
L
N
M1 M1
M3
I1
I1
O
H
J
J
J
E
P3
F1
P1
H
I1
O
I2
I2
F2
Module placement outline
Figure 69: TOBY-L2 series module suggest footprint (application board top view)
Parameter
Value
Parameter
Value
Parameter
Value
A
35.6 mm
H
0.80 mm
M2
5.20 mm
B
24.8 mm
I1
1.50 mm
M3
4.50 mm
D
2.40 mm
I2
1.80 mm
N
2.10 mm
E
2.25 mm
J
0.30 mm
O
1.10 mm
F1
1.45 mm
K
3.15 mm
P1
1.10 mm
F2
1.30 mm
L
7.15 mm
P2
1.25 mm
G
1.10 mm
M1
1.80 mm
P3
2.85 mm
Table 43: TOBY-L2 series module suggest footprint dimensions
The Non Solder resist Mask Defined (NSMD) pad type is recommended over the Solder resist Mask
Defined (SMD) pad type, implementing the solder resist mask opening 50
µ
m larger per side than the
corresponding copper pad.
The suggested paste mask (stencil) layout for TOBY-L2 series modules slightly reflects the copper
mask layout described in
, as different stencil apertures layout for any specific
pad is recommended:
Blue marked pads: Paste layout reduced circumferentially about 0.025 mm to Copper layout
Green marked pads: Paste layout enlarged circumferentially about 0.025 mm to Copper layout
Purple marked pads: Paste layout one to one to Copper layout
The recommended solder paste (stencil) thickness is 150
µ
m, according to application production
process requirements.
☞
These are recommendations only and not specifications. The exact mask geometries, distances
and stencil thicknesses must be adapted to the specific production processes (e.g. soldering etc.)
of the customer.
