Ublox SARA-N210, System Integration Manual

Page: 4 / 82

SARA-N2 series - System Integration Manual
UBX-17005143 - R06 Page 4 of 82
2.5 SIM interface .............................................................................................................................................. 43
2.6 Serial interfaces ........................................................................................................................................ 46
2.6.1 Asynchronous serial interface (UART) ......................................................................................... 46
2.6.2 Secondary asynchronous serial interface (Secondary UART)................................................. 48
2.6.3 DDC (I 2 C) interface ............................................................................................................................ 49
2.7 General Purpose Input/Output (GPIO) .................................................................................................. 49
2.8 Reserved pins (RSVD) .............................................................................................................................. 49
2.9 Module placement ....................................................................................................................................50
2.10 Module footprint and paste mask ......................................................................................................... 51
2.11 SARA-N211 integration in devices intended for use in potentially explosive atmospheres ....... 52
2.11.1 General guidelines ............................................................................................................................ 52
2.11.2 Guidelines for VCC supply circuit design ..................................................................................... 54
2.11.3 Guidelines for antenna RF interface design ................................................................................ 55
2.12 Schematic for SARA-N2 series module integration .......................................................................... 56
2.13 Design-in checklist .................................................................................................................................... 57
2.13.1 Schematic checklist ......................................................................................................................... 57
2.13.2 Layout checklist ................................................................................................................................ 57
2.13.3 Antenna checklist ............................................................................................................................. 58
3 Handling and soldering ..................................................................................................................... 59
3.1 Packaging, shipping, storage and moisture preconditioning .......................................................... 59
3.2 Handling ...................................................................................................................................................... 59
3.3 Soldering ..................................................................................................................................................... 60
3.3.1 Soldering paste ................................................................................................................................. 60
3.3.2 Reflow soldering ................................................................................................................................ 60
3.3.3 Optical inspection ............................................................................................................................. 61
3.3.4 Cleaning .............................................................................................................................................. 61
3.3.5 Repeated reflow soldering .............................................................................................................. 62
3.3.6 Wave soldering .................................................................................................................................. 62
3.3.7 Hand soldering .................................................................................................................................. 62
3.3.8 Rework ................................................................................................................................................ 62
3.3.9 Conformal coating ............................................................................................................................ 62
3.3.10 Casting ................................................................................................................................................ 63
3.3.11 Grounding metal covers .................................................................................................................. 63
3.3.12 Use of ultrasonic processes ........................................................................................................... 63
4 Approvals ............................................................................................................................................... 64
4.1 Approvals overview ................................................................................................................................... 64