UBX-G7020 - Hardware Integration Manual
Design-in
GPS.G7-HW-10003
Objective Specification
Page 41 of 74
2.9.2.1
QFN40 Package
Note the placement of GND vias inside the center GND plane of the package. As these vias are covered with
solder mask, there is no risk of solder paste being sucked into via holes during reflow. The landing pads for the
exterior pads extend slightly beyond the maximum package dimensions.
The checkerboard pattern of the solder mask opening ensures even distribution of solder paste across the large
center GND pad. Units below are in mm.
Figure 22: QFN40 (UBX-G7020-Kx) recommended copper land pattern
Figure 23: QFN40 (UBX-G7020-Kx) recommended solder mask opening pattern
For mechanical specifications see
UBX-G7020-Kx Data Sheet
Confidential
