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NEO-M8L - Hardware integration manual
UBX-16010549 - R08
Product handling
Page 18 of 28
C1-Public
⚠
Attention: use of a hot air gun can lead to overheating and severely damage the module. Always
avoid overheating the module.
After the module is removed, clean the pads before placing and hand soldering a new module.
⚠
Never attempt a rework on the module itself, for example, replacing individual components. Such
actions immediately terminate the warranty.
In addition to the two reflow cycles, manual rework on particular pins by using a soldering iron is
allowed. Manual rework steps on the module can be done several times.
Conformal coating
Certain applications employ a conformal coating of the PCB using HumiSeal
®
or other related coating
products. These materials affect the HF properties of the NEO-M8L modules and it is important to
prevent them from flowing into the module. The RF shields do not provide 100% protection for the
module from coating liquids with low viscosity; therefore, care is required in applying the coating.
☞
Conformal coating of the module will void the warranty.
Casting
If casting is required, use viscose or another type of silicon potant. The OEM is strongly advised to
qualify such processes in combination with the NEO-M8L modules before implementing this in the
production.
☞
Casting will void the warranty.
Grounding metal covers
Attempts to improve grounding by soldering ground cables, wick or other forms of metal strips
directly onto the EMI covers is done at the customer's own risk. The numerous ground pins should be
sufficient to provide optimum immunity to interferences and noise.
☞
u-blox makes no warranty for damages to the NEO-M8L modules caused by soldering metal cables
or any other forms of metal strips directly onto the EMI covers.
Use of ultrasonic processes
Some components on the u-blox M8 module are sensitive to ultrasonic waves. Use of any ultrasonic
processes (cleaning, welding etc.) may cause damage to the GNSS receiver.
☞
u-blox offers no warranty against damages to the NEO-M8L modules caused by any ultrasonic
processes.
