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•
b) Automated optical inspection (AOI) equipment
•
c) Nozzle with a 6 mm to 8 mm diameter
B. Baking equipment - a) Cabinet oven - b) Anti-static heat-resistant trays - c)
Anti-static heat-resistant gloves
2.
Storage conditions for a delivered module are as follows:
•
The moisture-proof bag must be placed in an environment where the temper
ature is below 30°C and the relative humidity is lower than 70%.
•
The shelf life of a dry-packaged product is 6 months from the date when the
product is packaged and sealed.
•
The package contains a humidity indicator card (HIC).
3.
Bake a module based on HIC status as follows when you unpack the module
package:
•
A. If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive
hours.
•
B. If the 30% circle is pink, bake the module for 4 consecutive hours.
•
C. If the 30% and 40% circles are pink, bake the module for 6 consecutive
hours.
•
D. If the 30%, 40%, and 50% circles are blue, bake the module for 12 consec
utive hours.
4.
Baking settings:
•
A. Baking temperature: 125±5°C
•
B. Baking time: 130°C
•
C. SMT placement ready temperature after natural cooling: < 36°C
•
D. The number of drying times: 1
•
E. Rebaking condition: The module is not soldered within 12 hours after baking.
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5.
Do not use SMT to process modules that have been unpacked for more than
