3 months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If
the solder pads are exposed to the air for more than 3 months, they will be
oxidized severely and dry joints or solder skips may occur. Tuya is not liable
for such problems and consequences.
6.
Before SMT placement, take electrostatic discharge (ESD) protective measures.
7.
To reduce the reflflow defect rate, draw 10% of the products for visual inspection
and AOI before the fifirst SMT placement to determine proper methods for con
trolling the oven temperature and attaching and placing components. Draw 5
to 10 modules from subsequent batches each hour for visual inspection and AOI.
6.3
Storage Conditions
7 Appendix-Statement
FCC Caution:
Any changes or modifications not expressly approved by the party
responsible for compliance could void the user’s authority to operate this equipment.
This device complies with Part 15 of the FCC Rules.Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2)
