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3 months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If 

the solder pads are exposed to the air for more than 3 months, they will be 

oxidized severely and dry joints or solder skips may occur. Tuya is not liable 

for such problems and consequences. 

6.

 

Before SMT placement, take electrostatic discharge (ESD) protective measures. 

 

7.

 

To reduce the reflflow defect rate, draw 10% of the products for visual inspection 

and AOI before the fifirst SMT placement to determine proper methods for con 

trolling the oven temperature and attaching and placing components. Draw 5 

 

to 10 modules from subsequent batches each hour for visual inspection and AOI. 

 

6.3

 

Storage Conditions 

 

 

7 Appendix-Statement 

 

FCC Caution: 

Any changes or modifications not expressly approved by the party 

 

responsible for compliance could void the user’s authority to operate this equipment.

 

 

This device complies with Part 15 of the FCC Rules.Operation is subject to the following two 

conditions: (1) This device may not cause harmful interference, and (2) 

Summary of Contents for WBR3S

Page 1: ...an develop embedded WiFi products as required 1 1 Features 1 Embedded low power 32 bit CPU which can also function as an application processor 2 The maxium clock rate 200 MHz 3 Working voltage 3 0 to...

Page 2: ...1 7 dBi at 2 4 G shared withWiFi Working temperature 20 to 85 1 2 Applications Intelligentbuilding Smart household and home appliances Smart socket and light Industrial wireless control Baby monitor...

Page 3: ...2 2 Normal Working Conditions 4 RF Parameters 4 1 Basic RF Features 5 AntennaInformation 5 1 Antenna Type...

Page 4: ...printed antenna 2 Make sure that the area around the printed antenna is far away from the metal copper skin so as to ensure the radiation effect of the antenna to the greatest extent 6 Packaging Info...

Page 5: ...dity indicator card HIC 3 Bake a module based on HIC status as follows when you unpack the module package A If the 30 40 and 50 circles are blue bake the module for 2 consecutive hours B If the 30 cir...

Page 6: ...l inspection and AOI before the fifirst SMT placement to determine proper methods forcon trolling the oven temperature and attaching and placing components Draw 5 to 10 modules from subsequent batches...

Page 7: ...lowing measures Reorient or relocate the receiving antenna Increase the separation between the equipment and receiver Connect the equipment into an outlet on a circuit different from that to which the...

Page 8: ...for OEM integrators under the following conditions The antenna must be installed such that 20cm is maintained between the antenna and users and 2 The transmitter module may not be co located with any...

Page 9: ...al and electronic equipment WEEE 2012 19 EU Instead it should be disposed of by returning it to the point of sale or to a municipal recycling collection point The device could be used with a separatio...

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