Technical Design-in Guide SLE G6 | 12-2018 | 2.1 | en
Thermal Aspects
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For the LED module SLE G6 tp a temperature of 65 °C must be maintained in order to achieve an optimum between heat sink
requirements, luminous flux and lifetime.
Adherence to the permitted tp temperature must be checked under operating conditions in a thermally stable state. For this the max.
ambient temperature of the relevant application must be taken into account.
Explanatory note
The actual cooling may deviate due to the material, the design, external and situative influences. A thermal compound between the
SLE G6 module and the heatsink using thermal paste or
is absolutely necessary.
thermally conductive adhesive foil
Additionally,
the SLE G6 module has to be mounted on the heat sink with M3 screws.
in order to optimise the thermal connection,
The calculation of the heat sink information is based on the use of thermally conductive paste with a thermal conductivity of > 1 W /
mK and a thickness of max. 50 µm or a thermally conductive adhesive foil with b <50 µmmK/W.
6.1.6. Requirements for the heat sink
Although the operating temperature of the modules is continually monitored during operation and the power is automatically reduced
in the event of excess temperature, the modules should not be operated without a heat sink.
The heat sinks must be dimensioned to provide adequate cooling capacity.
The R value is important for selecting an appropriate heat sink. This value depends on the light output of the module and on the
th
ambient temperature in which the module is to be operated. The R value of the heat sink must be smaller than the required R
th
th
value.
tr
specifies the thermal connection of the heat sink and the luminaire for the interchangeability with other Zhaga products.
max
_
I
NOTICE
Please check the information on heat sinks in the module data sheets.
