Technical Design-in Guide Engine QLE G2 PRE KIT | 01-2019 | 1.0 | en
Mechanical Aspects
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Protection measures in regards to sealing
The points above also apply to chemicals used for sealing luminaire casings. If however the LED module is not installed in the
luminaire until after the sealing compound has been completely cured (see relevant material information) the above points can be
ignored. If the LED modules have already been installed in the luminaire, possible damage to the encapsulant can be reduced to a
minimum by ensuring adequate spacing (>10 cm) and ventilation (open casing and air circulation, extraction / fan) during the curing
process.
Protection measures in regards to cementing
To avoid damaging the LED modules you must not use any tools or exert any pressure on the electronic components or the
encapsulant.
Instructions for cementing QLE G2 PRE modules
Preparation
Clean and durable bonding of two materials requires special attention. The following cleaning agents are recommended:
Important aspects
Additional information
QLE G2 PRE modules must not be stuck and restuck time and again without replacing the adhesive tape. Damaged adhesive tapes
must be completely removed and replaced by new tapes.
Packaging and transport
QLE G2 PRE Kits from Tridonic are delivered in appropriate packaging. The packaging provides special protection against mechanical
damage and ESD (electrostatic discharge). If you need to transport QLE G2 PRE products you should use this packaging.
If glass or Plexiglas shields are used make sure that pressure is not exerted on the encapsulant.
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Only touch the LED modules at the edges
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Isopropanol / Water 50/50
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Acetone
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Heptane
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Carrier material The carrier material must have adequate thermal conductivity (e.g. aluminium). The size of the cooling surface
depends on the power of the LEDs, among other things. For information on the cooling surface required, see the appropriate
product data sheet.
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Adhesive material The carrier material itself plays an important role in selecting the adhesive material. The crucial factors are
the coefficient of expansion and compatibility with the base material of the module board (plastic or aluminium). This must be
checked in the application in terms of long-term stability, surface contamination and mechanical properties.
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Surface quality The carrier material must be uncoated (thermal transport, adhesion) and level at the connection points.
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Installation temperature To achieve optimum adhesion we recommend you carry out this work at room temperature.
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Duration, optimum adhesive strengths Maximum adhesion is achieved within 48 hours at room temperature; the process is
accelerated by heat. In actual practice this means that at the maximum t temperature (approx. 75-85 °C, product-specific)
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maximum adhesion is reached after about 12 hours. During the curing period make sure that there is no tensile load on the
adhesive connection of the module.
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