Spartan-3E FPGA Industrial Micromodule
User Manual
Applications
■
IP (intellectual property) development
■
Digital signal processing
■
Image processing
■
Cryptography
■
Industrial control
■
Low-power design
■
General-purpose prototyping platform
Description
The FPGA industrial micromodule integ-
rates a leading edge Xilinx Spartan-3E
FPGA, an USB 2.0 microcontroller, config-
uration Flash, DDR SDRAM and power sup-
plies on a tiny footprint. A large number of
configurable I/Os are provided via B2B
mini-connectors.
The module is intended to be used as an
OEM board, or to be combined with our
carrier boards. It is a powerful system
widely used for educational and research
activities.
Boards with other configurations, larger
FPGA's or equipped with industrial temper-
ature grade parts are available on request.
Software for SPI flash programming over
USB as well as reference designs for high
speed data transfer over USB are included.
Physical Features
Board Dimensions
The module measures 40.50 mm by 47.50
mm.
Board-to-Board Connectors
The module has two B2B (board-to-board)
receptacle connectors (J4 and J5) for a
total of 160 contacts (Figure 5).
The ordering numbers of the connector re-
ceptacles are given in Table 1.
Trenz Electronic GmbH
3
Figure 5: micromodule receptacle.
Figure 4: connector receptacles J4
and J5 (bottom view).
Figure 3: module dimensions in mm
(top view).