User's Manual l TQMxE39S UM 0101 l © 2019 TQ-Group
Page 23
4.3
Mechanical and Thermal Considerations
The TQMxE39S is designed to operate in a wide range of thermal environments.
An important factor for each system integration is the thermal design. The heat spreader acts as a thermal coupling device to the
TQMxE39S. The heat spreader is thermally coupled to the CPU: It provides optimal heat transfer from the TQMxE39S to the heat
spreader. The heat spreader itself is not an appropriate heat sink.
System designers can implement different passive and active cooling versions through the thermal connection to the heat
spreader.
Attention: Thermal Considerations
Do not operate the TQMxE39S without heat spreader or without heat sink!
The heat spreader is not a sufficient heat sink!
If a special cooling solution has to be implemented, an extensive thermal design analysis and verification has to be performed.
TQ-Systems GmbH offers thermal analysis and simulation as a service.
Please contact
for more information about the thermal configuration.
4.4
Protection Against External Effects
The TQMxE39S itself is not protected against dust, external impact and contact (IP00).
Adequate protection has to be guaranteed by the surrounding system and carrier board.
To support applications in harsh environment, conformal coating can be offered as custom specific add-on.
Please contact
