Toshiba SD-25VLSR, Service Manual

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B4-1
DISASSEMBLY INSTRUCTIONS
Masking Tape
(Cotton Tape)
4.
REMOVAL
IC
Put the Masking Tape (cotton tape) around the Flat
Package IC to protect other parts from any damage.
(Refer to Fig. 4-1.) 1.
Fig. 4-1
NOTE
REMOVAL AND INSTALLATION OF
FLAT PACKAGE IC
Some ICs on the PCB are affixed with glue, so be
careful not to break or damage the foil of each IC
leads or solder lands under the IC when removing it.
NOTE
Masking is carried out on all the parts located within
10 mm distance from IC leads.
Blower type IC
desoldering machine
IC
Heat the IC leads using a blower type IC desoldering
machine. (Refer to Fig. 4-2.) 2.
Fig. 4-2
NOTE
Do not add the rotating and the back and forth
directions force on the IC, until IC can move back and
forth easily after desoldering the IC leads completely.
When IC starts moving back and forth easily after
desoldering completely, pickup the corner of the IC using
a tweezers and remove the IC by moving with the IC
desoldering machine. (Refer to Fig. 4-3.) 3.
Blower type IC
desoldering
machine
IC
Fig. 4-3
Tweezers
Peel off the Masking Tape. 4.
Absorb the solder left on the pattern using the Braided
Shield Wire. (Refer to Fig. 4-4.) 5.
NOTE
Do not move the Braided Shield Wire in the vertical
direction towards the IC pattern.
Braided Shield Wire
Soldering Iron
Fig. 4-4
IC pattern