LE940B6 HW User Guide
Rev. 2.02
Page 91 of 111
2020-01-10
Recommendations for PCB Pad Dimensions (mm)
Figure 27: PCB Pad Dimensions
It is not recommended to place around the pads a via or micro-via that is not covered by
solder resist in an area of 0.3 mm unless it carries the same signal as the pad itself (see
Figure 28).
Figure 28: Inhibit Area for Micro-via
Holes in pad are allowed only for blind holes and not for through holes.
Table 36: Recommendations for PCB Pad Surfaces
Finish
Layer Thickness (um)
Properties
Electro-less Ni / Immersion
Au
3-7 / 0.05-0.15
Good solder ability protection,
high shear force values
Provided
to
Dekra
under
NDA
Distribution
is
Prohibited
except
for
Dekra
employees
with
a Need
to
know
