LE940B6 HW User Guide
Rev. 2.02
Page 89 of 111
2020-01-10
Recommended Footprint for the Application
Figure 25 shows the top view of the module, which has 334 pads (dimensions are in mm).
To facilitate replacing the LE940B6 module if necessary, it is suggested to design the
application board with a 1.5 mm placement inhibit area around the module. These regions
are highlighted in Figure 25.
It is also suggested, as a common rule for an SMT component, to avoid having a
mechanical part of the application board in direct contact with the module.
NOTE:
In the customer application, the region marked as INHIBIT WIRING in Figure
25 must be clear of signal wiring or ground polygons.
Figure 25: Application Module Top View
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