ModuLam 130 Operators Manual
page 13
Grab the loose corners of the
release liner and pull hands
apart to apply a slight tension.
Release pressure on the
footswitch to restart the feed
motor.
As the carrier/substrate feeds
into the laminator, pull the
release liner away from the
film just fast enough to keep it
from passing into the
machine. This will apply a
mild tension to the film and
prevent any wrinkling or air
entrapment.
After the release liner has
pulled totally away from the
film, let the carrier/substrate
continue through the
laminator until it passes out
the other side. Use an X-Acto
knife to separate the substrate
from the carrier by cutting
along the inner edge of the
raised lip. If you are making
a double-sided PCB, flip the
substrate over and repeat the
above process on the other
side. Remember to peel off
the shiny Mylar film from the
photopolymer on the raised
lip of the carrier. This will
insure that your next
application of film will
adequately adhere.
You should remove the
photopolymer from the raised
lip of the carrier every 4 or 5
uses to prevent excessive
buildup.
