ModuLam 130 Operators Manual
page 11
Attach two pieces of Scotch
®
tape
on opposite sides of one corner of
the photopolymer. Using a quick
pull, break the dull, matte release
liner away from the adhesive side
of the photopolymer (photoresist or
soldermask).
Peel back 1" of the release liner
along one edge to expose the
adhesive side of the photopolymer.
Luckily the cover sheet sticks to the
photopolymer far better than the
peel sheet so it is just about
guaranteed that pulling the pieces
of tape apart will strip the peel
sheet as desired. If the shiny Mylar
cover peels away instead, move to
another corner and try again.
Do not remove the entire liner at this time. Peeling the sheets apart generates a fair amount of
static electricity. This will, almost certainly, attract any piece of dust in your entire facility and
deposit it at the worst possible spot in your circuit pattern.
Using a soft squeegee, adhere the
entire edge of exposed adhesive to
the raised lip of the lamination
carrier.
If you are not using a carrier,
adhere the film to the leading edge
of the copperclad substrate you are
coating. Please note that you may
not be able to use this pre-
laminated section of the film for
circuit imaging as a result of
wrinkles and/or trapped air bubbles.
