Texas Instruments TPS6103 Series, User Manual

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Bill of Materials, PCB Layout, and Schematic
3 SLVU080B – January 2003 – Revised September 2016
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TPS6103x EVM-208 For High Efficient Output Current Boost Converter
3 Bill of Materials, PCB Layout, and Schematic
Section contents:
• Section 3.1 Bill of Materials
• Section 3.2 PCB Layout
• Section 3.3 Schematic
3.1 Bill of Materials
The TPS6103x EVM Bill of Materials is shown in Table 2 with adjustable and fixed output voltage
versions.
More details about the design and component selection for the dc-dc converter can be found in the
SLUS534 data sheet.
Table 2. TPS6103x EVM Bill of Materials
Reference Description Manufacturer Comments
C3, C4 100 μ F 10 V, Low ESR tantalum size D Vishay 594D–107X0016C2T or 594D–107X0010C2T
C1 10 μ F X5R 6.3 V, capacitor SMD1206 TDK C3216X5R0J106M
C2 2.2 μ F X5R 10 V, capacitor SMD0805 TDK C2012X5R1A225M
L1 6.8
μ
H, CDRH124-6R8 Sumida SUMIDA CDRH104R–7R0, CDRH104R–100, or
EPCOS B82464–G4682-M
R4 200 k Ω ,1%, resistor SMD0805 TPS61030EVM, not used on the fixed output voltage versions
R3 1.8 M Ω ,1%, resistor SMD0805 TPS61030EVM, not used on the fixed output voltage versions
R6 1 M Ω , 1%, resistor SMD0805
R1 560 k Ω , 1%, resistor SMD0805
R2 180 k Ω , 1%, resistor SMD0805
J1, J2 Header 1×4, 0.1" pitch
J6, J7 Header 1×2, 0.1" pitch
J5 Header 1×3, 0.1" pitch With jumper set to V
BAT
J4 Header 1×3, 0.1" pitch With jumper set to GND
U1 TPS61030PW, TSSOP16 PowerPAD TI TPS61030EVM–208
TPS61031PW, TSSOP16 PowerPAD TPS61031EVM–208
TPS61032PW, TSSOP16 PowerPAD TPS61032EVM–208
3.2 PCB Layout
For all switch mode power supplies the PCB layout is a critical step in the power supply design process.
Figure 1 , Figure 2 , Figure 3 , and Figure 4 show the layout for the adjustable and fixed output voltage
EVMs. Please refer to the SLUS534 data sheet for further layout guidelines.
The required board area for the complete dc-to-dc converter solution takes up less than 494 mm
2
(19 mm × 26 mm) on a double-sided PCB, as it is indicated by the Figure 1 component placement.