General PowerPADE Design Considerations
1-19
General
Correct PCB layout and manufacturing techniques are critical for achieving
adequate transfer of heat away from the PowerPAD
IC package. More
details on proper board layout can be found in the
THS4081, THS4082
175-MHz Low-Power High-Speed Amplifiers data sheet (literature number
SLOS274). For more general information on the PowerPAD
package and its
thermal characteristics, see the Texas Instruments Technical Brief,
PowerPAD
Thermally Enhanced Package (literature number SLMA002) and
the
PowerPad
Made Easy application brief (literature number SLMA004).
Summary of Contents for THS4082
Page 1: ...September 2000 Mixed Signal Products User s Guide SLOU075...
Page 4: ...iv...
Page 26: ...1 20 General...
Page 31: ...THS4082 EVM Board Layouts 2 5 Reference Figure 2 3 THS4082 EVM PC Board Layout Component Side...
Page 32: ...THS4082 EVM Board Layouts 2 6 Reference Figure 2 4 THS4082 EVM PC Board Layout Back Side...